Lead frame for a magnetic sensor

ABSTRACT

A magnetic sensor is constituted using magnetic sensor chips mounted on stages supported by interconnecting members and a frame having leads in a lead frame. Herein, the stages are inclined upon plastic deformation of the interconnecting members. When the frame is held in a metal mold and the stages are pressed, the interconnecting members are elastically deformed, so that the magnetic sensor chips are bonded onto the stages placed substantially in the same plane and are then wired with the leads. Thereafter, the stages are released from pressure, so that the interconnecting members are restored from the elastically deformed states thereof. When the magnetic sensor chips are combined together to realize three sensing directions, it is possible to accurately measure three-dimensional bearings of magnetism, and the magnetic sensor can be reduced in dimensions and manufactured with a reduced cost therefore.

CROSS-REFERENCE TO RELATED APPLICATIONS:

This application is a divisional of U.S. patent application Ser. No.10/627,717,filed Jul. 28, 2003, now U.S. Pat No. 7,187,063 the entiretyof which is incorporated herein by reference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

This invention relates to methods for manufacturing magnetic sensors formeasuring bearings (or azimuths). This invention also relates to leadframes for use in magnetic sensors.

2. Description of the Related Art

In general, magnetic sensors are used to detect magnetism for thepurpose of measurement of bearings with regard to external magneticfields applied thereto.

FIG. 83 shows a conventionally-known magnetic sensor unit 64 in whichmagnetic sensors 51 and 61 are arranged on a surface 63 a of a board (orsubstrate) 63. This magnetic sensor unit 64 is capable of measuringbearings of an external magnetic field in a three-dimensional manner.

Specifically, the magnetic sensor 51 includes a magnetic sensor chip 52sensitive to components of an external magnetic field in two directions,wherein there are provided two sensing directions (namely, an X-axisdirection and a Y-axis direction), which are orthogonal to each other onthe surface 63 a of the board 63. The magnetic sensor 61 includes amagnetic sensor chip 62 sensitive to components of an external magneticfield in a single direction only, wherein a sensing direction lies in avertical direction (namely, a Z-axis direction) orthogonal to thesurface 63 a of the board 63.

Bearings of an external magnetic field are determined as vectors in athree-dimensional space upon detection of three-directional componentsof magnetism measured by the magnetic sensor chips 52 and 62.

As described above, the conventionally-known magnetic sensor unit 64provides the magnetic sensor chips 52 and 62 for the magnetic sensors 51and 61 respectively. Therefore, in the manufacture of the magneticsensor unit 64, it is necessary to produce the magnetic sensors 51 and61 respectively and to arrange them on the surface 63 a of the board 63at respective positions. This increases the number of steps in themanufacture of the magnetic sensor unit, thus increasing themanufacturing cost therefor.

In addition, the conventional magnetic sensor unit 64 has difficultiesin accurately arranging the magnetic sensor 61 in the surface 63 a ofthe board 63 so that the sensing direction of the magnetic sensor chip62 becomes orthogonal to the sensing direction of the magnetic sensorchip 52.

SUMMARY OF THE INVENTION

It is an object of the invention to provide a method for manufacturing amagnetic sensor that can accurately measure the three-dimensionalbearings of an external magnetic field, wherein the manufacturing costcan be reduced.

In a first aspect of the invention, there is provided a magnetic sensorthat can accurately measure bearings of an external magnetic field in athree-dimensional manner and that can be reduced in manufacturing costby simplifying the manufacturing steps using a specially-designed leadframe, which comprises at least two stages, a frame having a pluralityof leads encompassing the stages, and a plurality of interconnectingmembers for supporting the stages to be interconnected with the frame.Specifically, the interconnecting members are subjected to plasticdeformation so that the stages are respectively inclined; the stages arethen pressed under pressure while the frame is fixed in a prescribedposition so that the interconnecting members are elastically deformed;magnetic sensor chips are bonded onto the stages that are arrangedsubstantially in the same plane of the frame; wires are arranged tointerconnect together the leads and the magnetic sensor chips; andfinally, the stages are released from the pressure so that theinterconnecting members are restored from the elastically deformedstates thereof. As described above, the stages are inclined upon plasticdeformation of the interconnecting members before the magnetic sensorchips are bonded onto the stages; that is, the stages can be reliablyinclined at prescribed angles respectively simultaneously with themanufacture of the lead frame; therefore, it is possible to noticeablysimplify the manufacturing steps for the magnetic sensor. In addition,the magnetic sensor chips can be easily and simultaneously bonded ontothe stages, which are placed substantially in the same plane in advance.

In the above, one magnetic sensor chip has two sensing directions alongthe surface of the stage thereof, while the other magnetic sensor chiphas a single sensing direction along the surface of the stage thereof.Herein, by respectively inclining the stages at prescribed angles duringthe manufacture of the lead frame, it is possible to establish a desiredangular relationship between three sensing directions, which cross eachother in a three dimensional manner. This allows the magnetic sensor toaccurately detect components of magnetism in three sensing directionswithin a three-dimensional space, so that bearings of magnetism can bedetermined as a vector in the three-dimensional space.

In addition, it is possible to further arrange pressing members that areprojected from the rectangular frame portion towards the stages, whereinthe pressing members press the stages in the thickness direction of thelead frame. Under the condition where the stages are pressed by thepressing members in the thickness direction of the lead frame, theeasy-to-deform portions of the interconnecting members (or leads) areelastically deformed so that the stages are maintained at prescribedpositions against the frame. In order to mount magnetic sensor chips onthe stages, the pressing members are separated from the stages, whichare thus released from pressure applied thereto by the pressing members,whereby the stages can be placed substantially in the same plane; thus,it is possible to simultaneously bond the magnetic sensor chips onto thestages with ease.

In a second aspect of the invention, a lead frame comprises a frame, atleast two stages, leads, and interconnecting members as well asprojecting elements, which are projected upwardly or downwardly from thestages, respectively, wherein the interconnecting members have distortedportions that are subjected to plastic deformation upon depression ofthe projecting elements when the lead frame is placed in a metal moldthat is closed, so that the stages can be easily inclined against theframe.

In the above, magnetic sensor chips can be simultaneously bonded ontosurfaces of the stages, which are arranged substantially in the sameplane, before being inclined in the metal mold. Then, the projectingelements are pressed by the metal mold so as to incline the stages,which are then encapsulated in a resin. Therefore, it is possible toaccurately set a prescribed angle formed between the surfaces of themagnetic sensor chips with ease. In addition, the same metal mold isused to incline the stages and to form a molded resin casingencapsulating the lead frame including the inclined stages; hence, it ispossible to simplify the manufacturing steps for producing a magneticsensor. Furthermore, by adequately changing the shapes and dimensions ofthe projecting elements of the stages of the lead frame, it is possibleto easily change the inclined angles of the stages, thus producing avariety of magnetic sensors using the same metal mold.

In a third aspect of the invention, a lead frame for use in themanufacture of a magnetic sensor comprises at least two stages formounting magnetic sensor chips sensitive in a three-dimensional space, aframe having a plurality of leads arranged to encompass the stages, anda plurality of interconnecting members for interconnecting the stageswith the frame. Herein, when the stages are inclined at prescribedangles against the frame, ends of the interconnecting members, which arefixed to both side ends of the stages, are subjected to plasticdeformation. In addition, at least one stage interconnecting member isarranged to mutually interconnect the stages together, wherein it issubjected to plastic deformation as well. Specifically, a pair of stageinterconnecting members each having reduced dimensions are arranged tointerconnect together both side ends of the stages that are arrangedadjacent to each other. Alternatively, at least one stageinterconnecting member having a zigzag shape allowing plasticdeformation is arranged between the stages.

In a fourth aspect of the invention, a magnetic sensor is constituted byusing plural magnetic sensor chips, all of which are arranged inside ofthe same package and inclined against the bottom of the package. Whenusing two magnetic sensor chips, a first magnetic sensor chip has twosensing directions, and a second magnetic sensor chip has a singlesensing direction that crosses a plane defined by the two sensingdirections of the first magnetic sensor chip. Alternatively, each of thefirst and second magnetic sensor chips has two sensing directions suchthat a first plane defined by the two sensing directions of the firstmagnetic sensor chip crosses a second plane defined by the two sensingdirections of the second magnetic sensor chip. When using three magneticsensor chips each having a single sensing direction, the sensingdirection of the third magnetic sensor chip crosses the plane defined bythe sensing directions of the other two magnetic sensor chips.

In a fifth aspect of the invention, interconnecting members are arrangedin proximity to both side ends of stages and are arranged linearlysymmetrical with respect to an axial line passing through the centers ofthe stages, and they have distorted portions that can be distorted uponplastic deformation. Herein, magnetic sensor chips are bonded onto thestages that are placed substantially in the same plane before the stagesare inclined by pins and the like projected inside of a metal mold, forexample.

BRIEF DESCRIPTION OF THE DRAWINGS

These and other objects, aspects, and embodiments of the presentinvention will be described in more detail with reference to thefollowing drawings, in which:

FIG. 1 is a plan view showing a magnetic sensor that is manufactured inaccordance with a manufacturing method according to a first embodimentof the invention;

FIG. 2 is a longitudinal sectional view of the magnetic sensor shown inFIG. 1;

FIG. 3 is a plan view showing a lead frame on which magnetic sensorchips are mounted in accordance with the manufacturing method accordingto the first embodiment of the invention;

FIG. 4 is a longitudinal sectional view of the lead frame having themagnetic sensor chips shown in FIG. 3;

FIG. 5 is a cross sectional view in which a damper is used to press astage for mounting a magnetic sensor chip in a metal mold;

FIG. 6 is a cross sectional view in which the magnetic sensor chip ismounted on the stage clamped in the metal mold shown in FIG. 5;

FIG. 7 diagrammatically shows a hold mechanism constituted by a leadinwardly projected from a rectangular frame portion of the lead frameand a projecting portion projecting from the stage for mounting themagnetic sensor chip;

FIG. 8 diagrammatically shows the hold mechanism in which the lead andthe projecting portion are engaged with each other so as to hold thestage in an inclined condition;

FIG. 9 is a graph showing a relationship between output values of amagnetic sensor chip used for measurement of two-directional componentsof magnetism;

FIG. 10 is a plan view showing a lead frame for use in the manufactureof a magnetic sensor in accordance with a modification of the firstembodiment;

FIG. 11 is a longitudinal sectional view showing essential parts of thelead frame shown in FIG. 10;

FIG. 12 is a longitudinal sectional view simply showing stagesinterconnected with a lead in the lead frame of FIG. 10;

FIG. 13 is a longitudinal sectional view showing magnetic sensor chipsto be mounted on stages of the lead frame of FIG. 10 pressed by aclamper;

FIG. 14 is a sectional view showing the lead frame of FIG. 10 pressed bythe clamper, which is taken in another direction compared with FIG. 13;

FIG. 15 is a plan view showing a lead frame for use in the manufactureof a magnetic sensor in accordance with another modification of thefirst embodiment;

FIG. 16 is a longitudinal sectional view showing a stage connected witha lead of the lead frame of FIG. 15;

FIG. 17 is a longitudinal sectional view showing a magnetic sensor chipto be mounted on the stage of the lead frame of FIG. 15;

FIG. 18 is a plan view showing a lead frame for use in the manufactureof a magnetic sensor in accordance with a further modification of thefirst embodiment;

FIG. 19 is a longitudinal sectional view showing positionalrelationships between stages and leads in the lead frame of FIG. 18;

FIG. 20 is a longitudinal sectional view showing a magnetic sensor chipto be mounted on the stage of the lead frame of FIG. 18;

FIG. 21 is a longitudinal sectional view showing the magnetic sensorchip to be mounted on the stage of the lead frame of FIG. 18 pressed bypressing members;

FIG. 22 is a plan view showing a magnetic sensor that is manufactured inaccordance with a manufacturing method according to a second embodimentof the invention;

FIG. 23 is a longitudinal sectional view of the magnetic sensor shown inFIG. 22;

FIG. 24 is a plan view showing a lead frame in which magnetic sensorchips are mounted on stages;

FIG. 25 is a longitudinal sectional view of the lead frame havingprojecting elements in the backsides of the stages shown in FIG. 24;

FIG. 26 is a longitudinal sectional view of the lead frame having theprojecting elements shown in FIG. 25, which is placed in a metal mold;

FIG. 27 is a longitudinal sectional view of the lead frame having theprojecting elements shown in FIG. 25, which is placed in the metal moldactivated to incline the stages together with the magnetic sensor chips;

FIG. 28 is a plan view showing a lead frame for use in the manufactureof a magnetic sensor in accordance with a modification of the secondembodiment;

FIG. 29 is a longitudinal sectional view of the lead frame shown in FIG.28;

FIG. 30 is a plan view showing essential parts of a lead frame for usein the manufacture of a magnetic sensor in accordance with anothermodification of the second embodiment;

FIG. 31 is a plan view showing essential parts of a lead frame for usein the manufacture of a magnetic sensor in accordance with a furthermodification of the second embodiment;

FIG. 32 is a plan view showing essential parts of a lead frame for usein the manufacture of a magnetic sensor in accordance with a furthermodification of the second embodiment;

FIG. 33 is a plan view showing essential parts of a lead frame for usein the manufacture of a magnetic sensor in accordance with a furthermodification of the second embodiment;

FIG. 34 is a longitudinal sectional view showing the lead frame of FIG.33, which is held in a metal mold to incline stages together withmagnetic sensor chips;

FIG. 35 is a longitudinal sectional view showing a lead frame havingprojecting elements in surfaces of stages relative to first sides, whichis placed in a metal mold;

FIG. 36 is a longitudinal sectional view showing a lead frame havingprojecting elements in both surfaces and backsides of stages relative tofirst and second sides respectively, which is placed in a metal mold;

FIG. 37 is a plan view showing a lead frame for use in the manufactureof a magnetic sensor in accordance with a further modification of thesecond embodiment;

FIG. 38 is a longitudinal sectional view of the lead frame shown in FIG.37;

FIG. 39 is a plan view showing a lead frame for use in the manufactureof a magnetic sensor in accordance with a further modification of thesecond embodiment;

FIG. 40 is a longitudinal sectional view of the lead frame shown in FIG.39;

FIG. 41 is a plan view showing a lead frame for use in the manufactureof a magnetic sensor in accordance with a further modification of thesecond embodiment;

FIG. 42 is a plan view showing a lead frame for use in the manufactureof a magnetic sensor in accordance with a further modification of thesecond embodiment;

FIG. 43 is a longitudinal sectional view showing a lead frame havingprojecting elements in the backsides of stages, which is placed in ametal mold;

FIG. 44 is a longitudinal sectional view of the lead frame shown in FIG.23, in which stages are inclined under pressure applied by the metalmold;

FIG. 45 is a plan view showing a magnetic sensor that is manufactured ina manufacturing method according to a third embodiment of the invention;

FIG. 46 is a longitudinal sectional view showing essential parts of themagnetic sensor shown in FIG. 45;

FIG. 47 is a plan view showing a lead frame for use in the manufactureof the magnetic sensor shown in FIG. 45;

FIG. 48 is a longitudinal sectional view of the lead frame of FIG. 47 inwhich magnetic sensor chips are mounted on stages;

FIG. 49 diagrammatically shows a projected portion of a lead forsupporting a stage;

FIG. 50 is a longitudinal sectional view showing essential parts of thelead frame of FIG. 47 held by metal molds, in which stages are inclinedtogether with magnetic sensor chips;

FIG. 51 is a plan view showing a lead frame for use in the manufactureof a magnetic sensor in accordance with a modification of the thirdembodiment;

FIG. 52 is a longitudinal sectional view of the lead frame shown in FIG.51, which is held between metal molds;

FIG. 53A diagrammatically shows a modification of a lead that ispartially bent;

FIG. 53B diagrammatically shows another modification of a lead that ispartially reduced in thickness;

FIG. 53C diagrammatically shows a further modification of a lead that ispartially formed in a zigzag shape;

FIG. 54 is a plan view showing a lead frame for use in the manufactureof a magnetic sensor in accordance with another modification of thethird embodiment;

FIG. 55 is an enlarged plan view showing essential parts of a lead framefor use in the manufacture of a magnetic sensor in accordance with afurther modification of the third embodiment;

FIG. 56A is an enlarged plan view showing essential parts of a leadframe for use in the manufacture of a magnetic sensor in accordance witha further modification of the third embodiment;

FIG. 56B is an enlarged plan view showing essential parts of a leadframe for use in the manufacture of a magnetic sensor in accordance witha further modification of the third embodiment;

FIG. 57 is an enlarged plan view showing essential parts of a lead framefor use in the manufacture of a magnetic sensor in accordance with afurther modification of the third embodiment;

FIG. 58 is an enlarged plan view showing essential parts of a lead framefor use in the manufacture of a magnetic sensor in accordance with afurther modification of the third embodiment;

FIG. 59 is an enlarged plan view showing essential parts of a lead framefor use in the manufacture of a magnetic sensor in accordance with afurther modification of the third embodiment;

FIG. 60 is an enlarged plan view showing essential parts of a lead framefor use in the manufacture of a magnetic sensor in accordance with afurther modification of the third embodiment;

FIG. 61 is an enlarged plan view showing essential parts of a lead framefor use in the manufacture of a magnetic sensor in accordance with afurther modification of the third embodiment;

FIG. 62 is a plan view showing a lead frame for use in the manufactureof a magnetic sensor in accordance with a further modification of thethird embodiment;

FIG. 63 is a plan view showing a magnetic sensor that is manufactured ina manufacturing method according to a fourth embodiment of theinvention;

FIG. 64 is a side view showing essential parts of the magnetic sensorshown in FIG. 63;

FIG. 65 is a side view showing a different arrangement of magneticsensor chips in the magnetic sensor;

FIG. 66 is a plan view showing a magnetic sensor that is manufactured inaccordance with a modification of the fourth embodiment;

FIG. 67 is a side view showing essential parts of the magnetic sensorshown in FIG. 66;

FIG. 68 is a side view showing a different arrangement of magneticsensor chips in the magnetic sensor;

FIG. 69 is a side view showing a different arrangement of magneticsensor chips in the magnetic sensor;

FIG. 70 is a side view showing a different arrangement of magneticsensor chips in the magnetic sensor;

FIG. 71 is a plan view showing a magnetic sensor that is manufactured inaccordance with a further modification of the fourth embodiment;

FIG. 72 is a side view showing essential parts of the magnetic sensorshown in FIG. 71;

FIG. 73 is a plan view showing a magnetic sensor that is manufactured inaccordance with a further modification of the fourth embodiment;

FIG. 74 is a side view showing essential parts of the magnetic sensorshown in FIG. 73;

FIG. 75 is a plan view showing a magnetic sensor having a singlemagnetic sensor chip for consideration of the fourth embodiment of theinvention;

FIG. 76 is a side view simply showing essential parts of the magneticsensor shown in FIG. 75;

FIG. 77 is a plan view showing a magnetic sensor that is manufactured ina manufacturing method according to a fifth embodiment of the invention;

FIG. 78 is a longitudinal sectional view showing essential parts of themagnetic sensor shown in FIG. 77;

FIG. 79 is a plan view showing a lead frame for use in the manufactureof the magnetic sensor shown in FIG. 77;

FIG. 80 is a longitudinal sectional view showing essential parts of thelead frame in which magnetic sensor chips are mounted on stages placedsubstantially in the same plane;

FIG. 81 is a longitudinal sectional view showing essential parts of alead frame that is held in a metal mold in which the stages are inclinedupon upward pressure applied thereto by pins;

FIG. 82A is an enlarged plan view showing a stage supported by leadshaving distorted portions in accordance with a modification of the fifthembodiment;

FIG. 82B is an enlarged sectional view showing the stage that isinclined due to distortion of the leads shown in FIG. 82A;

FIG. 83 is a perspective view showing a conventionally-known example ofa magnetic sensor unit using two magnetic sensor chips for measurementof three-directional components of magnetism;

FIG. 84 shows a relationship between mathematical expressions andbearings with respect to the magnetic sensor chip measuringtwo-directional components of magnetism;

FIG. 85A is a longitudinal sectional view showing a horizontalarrangement of magnetic sensor chips on a board having a cover;

FIG. 85B is a longitudinal sectional view showing a vertical arrangementof magnetic sensor chips on a board having a cover;

FIG. 86 diagrammatically shows inclined states of magnetic sensor chipsthat are inclined at prescribed angles respectively;

FIG. 87A diagrammatically shows a layout of chips including magneticsensor chips on a board;

FIG. 87B is a longitudinal sectional view taken along line A-A′ in FIG.87A;

FIG. 88 diagrammatically shows a layout of chips including magneticsensor chips on a board;

FIG. 89 is a longitudinal sectional view showing a multi-chip packageincluding magnetic sensor chips vertically coupled together on a boardhaving a cover;

FIG. 90 diagrammatically shows the configuration of a multi-chip packageincluding magnetic sensor chips vertically coupled together with respectto a board;

FIG. 91A is a plan view showing a first example of a lead frame forconstituting a magnetic sensor chip;

FIG. 91B is a longitudinal sectional view taken along line A-A′ in FIG.91A;

FIG. 92A is a plan view showing a second example of a lead frame forconstituting a magnetic sensor chip;

FIG. 92B is a longitudinal sectional view taken along line A-A′ in FIG.92A;

FIG. 93A is a plan view showing a third example of a lead frame forconstituting a magnetic sensor chip;

FIG. 93B is a longitudinal sectional view taken along line A-A′ in FIG.93A;

FIG. 94A is a plan view showing a fourth example of a lead frame forconstituting a magnetic sensor chip;

FIG. 94B is a longitudinal sectional view taken along line A-A′ in FIG.94A;

FIG. 95A is a plan view showing a fifth example of a lead frame forconstituting a magnetic sensor chip;

FIG. 95B is a longitudinal sectional view taken along line A-A′ in FIG.95A;

FIG. 96A is a plan view showing a sixth example of a lead frame forconstituting a magnetic sensor chip;

FIG. 96B is a longitudinal sectional view taken along line A-a′ in FIG.96A;

FIG. 97A is a plan view showing a seventh example of a lead frame forconstituting a magnetic sensor chip; and

FIG. 97B is a longitudinal sectional view taken along line A-a′ in FIG.97A.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

This invention will be described in further detail by way of exampleswith reference to the accompanying drawings.

1. First Embodiment

The overall configuration of a magnetic sensor, which is manufactured inaccordance with a first embodiment of the invention, will be describedwith reference to FIGS. 1 and 2. That is, a magnetic sensor 1 of FIG. 1is designed to measure the direction and magnitude of an externalmagnetic field applied thereto, and it comprises two magnetic sensorchips 2 and 3, a plurality of leads 4 for electrically connecting themagnetic sensor chips 2 and 3 with an external device (not shown), and amolded resin casing 5 for integrally fixing the magnetic sensor chips 2and 3 and the leads 4 therein.

Each of the magnetic sensor chips 2 and 3 is formed in a rectangularplate-like shape in plan view, and they are mounted on stages 6 and 7respectively. The magnetic sensor chips 2 and 3 are both encapsulated inthe molded resin casing 5, which has a lower surface 5 a and an uppersurface 5 c, and compared with leads 4, they are arranged in proximityto the upper surface 5 c. In addition, the magnetic sensor chips 2 and 3respectively having surfaces 2 a and 3 a are inclined with respect tothe ‘horizontal’ lower surface 5 a of the molded resin casing 5, andends 2 c and 3 c of the surfaces 2 a and 3 a of the magnetic sensorchips 2 and 3 are directed to the lower surface 5 a, while the otherends are respectively inclined in opposite directions at the same acuteangle θ to the lower surface 5 a.

In the above, the acute angle θ is formed between a surface 6 d of thestage 6 and a backside 7 c of the stage 7.

The magnetic sensor chip 2 is sensitive to two-directional components ofterrestrial magnetism with respect to an external magnetic field. Thatis, it has two sensing directions (namely, directions A and B) thatmutually cross at a right angle along the surface 2 a of the magneticsensor chip 2.

In contrast, the magnetic sensor chip 3 is sensitive to single-directioncomponents of terrestrial magnetism with respect to an external magneticfield; that is, it has a single sensing direction (namely, a directionC) along a plane (or an A-B plane defined by A and B directions) of thesurface 3 a.

Each of the leads 4 is made of a prescribed metal material such ascopper, wherein backsides 4 a of the leads 4 are exposed in the lowersurface 5 a of the molded resin casing 5. Ends 4 b of the leads 4 areelectrically connected with the magnetic sensor chips 2 and 3 via metalwires 8, wherein connecting portions therebetween are embedded in themolded resin casing 5.

Next, a method for manufacturing the magnetic sensor 1 will be describedin detail.

First, a thin metal plate is subjected to press working so as to form alead frame 10 as shown in FIGS. 3 and 4 in which both the stages 6 and 7are supported by a frame 9.

The frame 9 is constituted by a rectangular frame portion 11, which isformed in a rectangular shape in plan view to encompass the stages 6 and7, and a plurality of leads 4, 12, 13, and 14 that project inwardly fromthe rectangular frame portion 11.

The leads (or interconnecting members) 12 and 13 are hanging leads forfixing the stages 6 and 7 in prescribed positions relative to therectangular frame portion 11, and the leads 12 are interconnected withfirst sides 6 a and 7 a of the stages 6 and 7, while the leads 13 areinterconnected with second sides 6 b and 7 b of the stages 6 and 7.

Specifically, the leads 13 have a specific structure having variouscomponents that are mutually interconnected together between the stages6 and 7, wherein projecting portions 13 b are projected from the centerportions of the leads 13 and are directed towards the stages 6 and 7respectively. When the stages 6 and 7, on which the magnetic sensorchips 2 and 3 are respectively mounted, are inclined, the projectingportions 13 b prevent the magnetic sensor chips 2 and 3 from movingdownwards along slopes.

The leads 14 (constituting second projecting portions) are projectedtowards the stages 6 and 7, from which projecting portions 15 (namely,first projecting portions) are projected from the stages 6 and 7 towardsthe rectangular frame portion 11 and the leads 14. Herein, the leads 14and the projecting portions 15 form a hold mechanism 100 for holding thestages 6 and 7 in inclined conditions at prescribed angles.

Internal areas of the lead frame 10 including the stages 6 and 7, whichare present inwardly from the leads 4, can be formed at an arbitrarythickness upon application of photo-etching processes, wherein they areformed to have roughly half the thickness compared with other portionsof the lead frame 10 in order to prevent the leads 12 and the backsides6 c and 7 c of the stages 6 and 7 from being exposed below the lowersurface 5 a of the molded resin casing 5.

In addition to press working, bending working is performed to inclinethe stages 6 and 7 against the frame 9, so that they are mutuallyinclined to each other. Details will be described with reference toFIGS. 5 and 6. Due to bending working as shown in FIG. 5, ends 12 a and13 a of the leads 12 and 13 (constituting bent portions), arranged inproximity to the stages 6 and 7, are bent and subjected to plasticdeformation, so that the stages 6 and 7 are inclined at prescribedangles respectively. The bending working is performed using the samemetal mold (not shown), which is used to perform the press working.

Then, the rectangular frame portion 11 of the frame 9 is fixed in ametal mold D, and a rod-like damper E is used to press the surfaces 6 dand 7 d of the stages 6 and 7 at prescribed positions in proximity tofirst sides 6 a and 7 a of the stages 6 and 7. Herein, the metal mold Dhas a surface D1 and a hollow (or hole) D2, so that one end 12 a of thelead 12 is put into the space of the hollow D2 and is thus preventedfrom being further deformed. The lead 12 has an easy-to-deform portion12 b, which can be elastically deformed with ease. A prescribed shape isadapted to the easy-to-deform portion 12 b by a photo-etching process,wherein the easy-to-deform portion 12 b is formed to have roughly halfthe thickness compared with other portions of the lead 12, for example.

Therefore, the easy-to-deform portion 12 b of the lead 12 and the bentportion of the lead 13 (which has already been subjected to plasticdeformation) are elastically deformed so that the surfaces 6 d and 7 dof the stages 6 and 7 are arranged along the surface D1 of the metalmold D, as shown in FIG. 6.

In the aforementioned condition shown in FIG. 6, the magnetic sensorchips 2 and 3 are respectively adhered to the surfaces 6 d and 7 d ofthe stages 6 and 7 by using silver paste, and the aforementioned wires 8are arranged to electrically connect the magnetic sensor chips 2 and 3with the leads 4 as shown in FIGS. 3 and 4.

In the next step after the aforementioned step for arranging the wires8, the stages 6 and 7 are respectively inclined so that bonding portionsbetween the wires 8 and the magnetic sensor chips 2 and 3, and otherbonding portions between the wires 8 and the leads 4 may be separatedfrom each other. For this reason, the wires 8 are arranged to havesufficient room in length or height.

Thereafter, the damper E is gradually moved upwards above the stages 6and 7, which are thus released so that the bent portions and theeasy-to-deform portions 12 b are restored from elastic deformation;thus, it is possible to restore the stages 6 and 7 to inclined states.At this time, ends 2 c and 3 c of the magnetic sensor chips 2 and 3 arebrought into contact with the projecting portions 13 b of the lead 13,so that even if the silver paste has not hardened, it is possible toreliably prevent the magnetic sensor chips 2 and 3 from beingunexpectedly moved downwards along slopes.

When the silver paste has hardened, the magnetic sensor chips 2 and 3are firmly fixed at prescribed positions on the surfaces 6 d and 7 d ofthe stages 6 and 7.

Simultaneously with the hardening of the silver paste, the holdmechanism 100 holds the stages 6 and 7 in inclined conditions atprescribed angles. That is, as shown in FIG. 7, a hollow 14 b is formedon a surface 14 a of the lead 14 upon application of a photo-etchingprocess. In addition, a projection 15 b is formed on a lower end surface15 a of the projecting portion 15 upon application of the aforementionedpress working.

As shown in FIG. 8, the lead 14 and the projecting portion 15 are movedso as to vertically overlap each other in the thickness direction of thelead frame 10, and the projection 15 b is inserted into the hollow 14 bof the lead 14, thus constituting the hold mechanism 100. Due to theprovision of the hold mechanism 100, the stages 6 and 7 that areinclined at prescribed angles are held so as not to return towards theframe 9.

In the above, it is necessary to move the projection 15 b towards thehollow 14 b of the lead 14 in the thickness direction of the lead frame10. Herein, it may be possible to use a cam mechanism, by which theprojection 15 b can be inserted into the hollow 14 b in response to adriving force for causing the damper E to move up or down, for example.

The lead frame 10 on which the magnetic sensor chips 2 and 3 are mountedis arranged inside of a metal mold (not shown), into which a meltedresin is introduced so as to form a molded resin casing forencapsulating the magnetic sensor chips 2 and 3 therein. Thus, it ispossible to firmly fix the magnetic sensor chips 2 and 3, which aremutually inclined in opposite directions, inside of the molded resincasing. Thereafter, the ‘unwanted’ rectangular frame portion 11 is cutout, thus completing the manufacture of the magnetic sensor 1 shown inFIG. 1.

In the aforementioned manufacturing method, photo-etching processes thatare effected on various parts of the lead frame 10 are performed beforeapplication of the press working on the thin metal plate.

The aforementioned magnetic sensor 1 is mounted on a board (or asubstrate) installed in a portable terminal device (or a mobile terminaldevice, not shown), for example, in which bearings of terrestrialmagnetism measured by the magnetic sensor 1 are displayed on a displayscreen. Next, a description will be given with respect to a method ofmeasuring bearings of terrestrial magnetism using the magnetic sensor 1;hereinafter, ‘terrestrial magnetism’ will be simply referred to as‘magnetism’.

That is, the magnetic sensor chips 2 and 3 respectively detectcomponents of magnetism in A, B, and C directions, thus producing valuesSa, Sb, and Sc approximately in proportion to components of magnetism inthese directions.

FIG. 9 shows a relationship between output values Sa and Sb of themagnetic sensor chip 2. When a magnetism direction is defined along theA-B plane, the output value Sa becomes maximal when the direction B ofthe magnetic sensor chip 2 is directed towards the east, while itbecomes minimal when the direction B is directed towards the west, andit becomes zero when the direction B is directed towards the south orthe north.

In addition, the output value Sb becomes maximal when the direction B ofthe magnetic sensor chip 2 is directed towards the north, while itbecomes minimal when the direction B is directed towards the south, andit becomes zero when the direction B is directed towards the east or thewest.

Incidentally, the output values Sa and Sb shown in the graph of FIG. 9are created such that the values actually output from the magneticsensor 1 are each divided by half of the difference between the maximalvalue and the minimal value.

A bearing ‘a’ is displayed on a display screen of a portable terminaldevice in such a way that east is represented by 0°, and it is increasedas the device is rotatably moved in a direction from the east to thesouth, west, and north in turn. The bearing ‘a’ is determined inaccordance with mathematical expressions as written in a table shown inFIG. 84, for example.

When a magnetism direction is defined crossing the A-B plane, themagnetic sensor 1 uses an output of the magnetic sensor chip 3 inaddition to outputs of the magnetic sensor chip 2, and the magneticsensor chip 3 detects components of magnetism in the direction C(crossing the A-B plane) so as to produce a value Sc approximately inproportion to them.

Similar to the aforementioned values Sa and Sb, the output value Sc iscreated such that the value actually output from the magnetic sensor 1is divided by half of the difference between the maximal value and theminimal value.

Upon detection of components of magnetism in the direction C (crossingthe A-B plane), the output value Sc is produced and is combined with theaforementioned output values Sa and Sb so as to produce a vector in athree-dimensional space for determination of a magnetism direction.

An angle θ formed between the direction C and the A-B plane is greaterthan 0° and is not greater than 90°; theoretically, it is possible todetermine three-dimensional bearings of magnetism when the angle θ isgreater than 0°. Actually, however, it is preferable that the angle θ isnot less than 20°, and it is further preferable that the angle θ is notless than 30°.

In the manufacturing method of the magnetic sensor 1 described above,the same metal mold is used to simultaneously perform the press working,in which a pattern of the lead frame 10 is extracted from a thin metalplate, and the bending working in which the stages 6 and 7 are inclined.Therefore, it is possible to simplify the manufacturing processes.

In addition, the damper E is used to press the stages 6 and 7 toelastically deform the easy-to-deform portions 12 b of the leads 12 andthe bent portions of the leads 13, and the magnetic sensor chips 2 and 3are bonded to the stages 6 and 7 that are arranged substantially in thesame plane. Therefore, it is possible to simultaneously and easily bonda plurality of magnetic sensor chips onto the stages. That is, it ispossible to reduce the manufacturing cost of the magnetic sensor 1.

The stages 6 and 7 are inclined in the manufacture of the lead frame 10;therefore, it is possible to accurately set inclined angles with respectto the stages 6 and 7. In addition, the lead 14 and the projectingportion 15 partially overlap each other and are fixed together;therefore, it is possible to reliably hold the stages 6 and 7 so as notto return towards the frame 9. Thus, it is possible to accurately setthe angle formed between the surfaces 2 a and 3 a of the magnetic sensorchips 2 and 3 with ease.

As described above, it is possible to accurately cross a sensingdirection of the magnetic sensor chip 3 with the A-B plane, thusestablishing three sensing directions in total. This allows bearings ofmagnetism measured in three sensing directions to be determined as avector in a three-dimensional space, whereby it is possible toaccurately measure the bearings of magnetism within a three-dimensionalspace.

In the first embodiment, the bent portions of the lead 13 are adequatelybent and are subjected to plastic deformation when the stages 6 and 7are inclined. Of course, this invention is not necessarily limited tothe first embodiment; therefore, the bent portions of the lead 13 forsupporting the stages 6 and 7 are subjected to plastic deformation suchthat the stages 6 and 7 are inclined.

In the first embodiment, bent portions firstly being subjected toplastic deformation are ends 13 a of the leads 13 for interconnectingthe stages 6 and 7, and ends 12 a of the leads 12 for interconnectingthe frame 9 with the stages 6 and 7; and the next portions beingsubjected to elastic deformation are ends 13 a of the leads 13, whichhave already been subjected to plastic deformation, and theeasy-to-deform portions 12 b of the leads 12. This invention is notnecessarily limited to the first embodiment in terms of the positions ofthe bent portions and easy-to-deform portions 12 b, the bendingdirections, and the directions of elastic deformation, which can beadequately set in response to the inclined directions and angles of thestages 6 and 7.

In the first embodiment, after the magnetic sensor chips 2 and 3 arebonded onto the surfaces 6 d and 7 d of the stages 6 and 7, the wires 8are arranged, and then, the bent portions and easy-to-deform portions 12b are restored from the elastically deformed states thereof. Of course,this invention is not necessarily limited to the first embodiment. Thatis, it is possible to modify the first embodiment in such a way thatafter the bonding of the magnetic sensor chips 2 and 3, the stages 6 and7 are respectively inclined at prescribed angles, and then, silver pasteis hardened. Herein, the damper E is activated again to arrange bothsurfaces 6 d and 7 d of the stages 6 and 7 substantially in the sameplane, so that the wires 8 are arranged, and then, the bent portions andeasy-to-deform portions 12 b are restored from the elastically deformedstates thereof.

In the first embodiment, after ends 13 a of the leads 13 and theeasy-to-deform portions 12 b of the leads 12 are restored from theelastically deformed states thereof, the silver paste for bonding themagnetic sensor chips 2 and 3 onto the stages 6 and 7 is subjected tohardening, but this is not restrictive. That is, the silver paste can behardened before ends 13 a of the leads 13 and the easy-to-deformportions 12 b of the leads 12 are restored from the elastically deformedstates thereof. In this case, it is unnecessary to arrange theprojecting portions 13 b, which are originally arranged to prevent themagnetic sensor chips 2 and 3 from being unexpectedly moved when thestages 6 and 7 are inclined.

In addition, the magnetic sensor chips 2 and 3 are not necessarilyinclined in such a way that ends 2 b and 3 b thereof are directed to theupper surface 5 c of the molded resin casing 5. That is, it is requiredthat the magnetic sensor chips 2 and 3 are mutually inclined to eachother with respect to the frame 9, thus crossing the sensing directionof the magnetic sensor chip 3 with the A-B plane.

The first embodiment can be modified in a variety of ways, which will bedescribed with reference to examples.

A first modified example of the first embodiment will be described indetail with reference to FIGS. 10 to 14, wherein the overallconfiguration of a magnetic sensor is basically identical to that of theforegoing magnetic sensor 1 shown in FIGS. 1 and 2, whereas the leadframe 10 (see FIG. 3) is replaced with a new one (see FIG. 10) for usein the manufacture of the magnetic sensor. In FIGS. 10 to 14, partsidentical to those shown in FIGS. 1 to 8 are designated by the samereference numerals; hence, the detailed description thereof will beomitted.

Prior to the manufacture of a magnetic sensor, a thin metal plate issubjected to press working, photo-etching, and bending workingsimultaneously by use of the same metal mold, whereby it is possible toproduce a lead frame 20 including two stages 6 and 7, which aresupported by a frame 19 (see FIG. 10). The frame 19 comprises aplurality of leads 4, 21, and 22 that are inwardly projected from arectangular frame portion 11.

The leads 21 and 22 are hanging leads for fixing the stages 6 and 7 inprescribed positions relative to the rectangular frame portion 11, andthe leads 21 are arranged to be interconnected with first sides 6 a and7 a of the stages 6 and 7 respectively. The leads 22 have a specificstructure that is arranged between the stages 6 and 7, and they have anintermediate portion 22 d interconnected with second sides 6 b and 7 bof the stages 6 and 7.

Ends 21 a (i.e., bent portions) of the leads 21 are located in proximityto the stages 6 and 7, and they are bent in plastic deformation uponapplication of bending working so that the stages 6 and 7 will beinclined at prescribed angles. In addition, a pair of bent portions 22 aare formed at prescribed positions of the leads 22, between which theintermediate portion 22 d is sandwiched, and are subjected to plasticdeformation upon bending working, so that the intermediate portion 22 dof the leads 22 is slightly projected against the rectangular frameportion 11 in the thickness direction of the lead frame 20. Furthermore,a pair of bent portions 22 b are bent in plastic deformation uponbending working and are arranged to adjoin the second sides of thestages 6 and 7 respectively.

Therefore, as shown in FIGS.11 and 12, due to the provision of ends 21 aof the leads 21 and the bent portions 22 a and 22 b of the leads 22, thestages 6 and 7 are mutually inclined to each other such that the secondsides 6 b and 7 b thereof are moved in the same thickness direction ofthe rectangular frame portion 11.

In addition, easy-to-deform portions 22 c that can be elasticallydeformed with ease are formed at positions between the pair of bentportions 22 a and the intermediate portion 22 d of the leads 22. Theyare specifically shaped by photo-etching and are formed to have roughlyhalf the thickness compared with other portions of the lead 22.

The aforementioned lead frame 20 is mounted on a planar surface F1 of ametal mold F as shown in FIGS. 13 and 14, and a damper G having arod-like shape is used to press the surface of the intermediate portion22 d of the leads 22, whereby the easy-to-deform portions 22 c areelastically deformed so that the backside of the intermediate portion 22d of the leads 22 is brought into contact with the surface F1 of themetal mold F. At this time, surfaces 6 d and 7 d of the stages 6 and 7interconnected with the intermediate portion 22 d of the leads 22 arearranged along the surface F1 of the metal mold F.

In the aforementioned condition, the magnetic sensor chips 2 and 3 arebonded onto the surfaces 6 d and 7 d of the stages 6 and 7 by usingsilver paste, while the leads 4 are wired together with the magneticsensor chips 6 and 7. After completion of hardening of the silver paste,the damper G is released from the intermediate portion 22 d of the lead22, whereby ends 21 a of the leads 21, and the bent portions 22 b andeasy-to-deform portions 22 c of the leads 22 are all restored from theelastically deformed states, so that the stages 6 and 7 arecorrespondingly restored to the inclined states. Then, theaforementioned hold mechanism 100 holds the stages 6 and 7 to berespectively inclined at prescribed angles. Lastly, a molded resincasing is formed to encapsulate the magnetic sensor chips 2 and 3 in aresin; then, unwanted portions such as the rectangular frame portion 11are cut, thus completing the manufacture of the magnetic sensor.

In the first modified example as shown in FIGS. 10 to 14, both the pressworking and bending working are simultaneously performed using the samemetal mold; hence, it is possible to simplify the steps in themanufacture of the magnetic sensor. Herein, ends 21 a of the leads 21and the bent portions 22 b and easy-to-deform portions 22 c of the leads22 are subjected to elastic deformation, whereby a plurality of magneticsensor chips can be easily and simultaneously bonded onto a plurality ofstages, which are placed substantially in the same plane. Thus, it ispossible to reduce the manufacturing cost of the magnetic sensor.

During the manufacture of the lead frame 20, the stages 6 and 7 areinclined at prescribed angles respectively, and the hold mechanism 100holds the stages 6 and 7 so as not to be restored in position towardsthe frame 9. Therefore, it is possible to accurately set a prescribedangle mutually formed between surfaces 2 a and 3 a of the magneticsensor chips 2 and 3 with ease.

Next, a second modified example of the first embodiment will bedescribed with reference to FIGS. 15 to 17, wherein parts identical tothose shown in FIGS. 1 to 8 are designated by the same referencenumerals; hence, the detailed description thereof will be omitted.

In the manufacture of a magnetic sensor, a thin metal plate issimultaneously subjected to press working, photo-etching, and bendingworking by using the same metal mold, thus producing a lead frame 30including two stages 6 and 7, which are supported by a frame 29 as shownin FIG. 15. The frame 29 comprises a plurality of leads 4, 31, and 32that are inwardly projected from a rectangular frame portion 11.

The leads 31 and 32 are hanging leads for fixing the stages 6 and 7 atprescribed positions relative to the rectangular frame portion 11, and apair of leads 31 are arranged to be interconnected with a first side 6 eof the stage 6, while a pair of leads 32 are arranged to beinterconnected with a first side 7 e of the stage 7. Herein, the firstsides 6 e and 7 e are arranged in the width directions of the stages 6and 7 and are both perpendicular to a direction for arranging the stages6 and 7 so as to adjoin together, and they are arranged opposite secondsides 6 f and 7 f in the stages 6 and 7 respectively, wherein they arerespectively arranged on opposite sides with respect to the stages 6 and7.

In addition, bent portions 31 a and 32 a are formed at prescribedpositions of the leads 31 and 32 to incline the stages 6 and 7 againstthe rectangular frame portion 11, and they are subjected to plasticdeformation upon bending working effected on the leads 31 and 32, sothat the stages 6 and 7 are maintained to be inclined at prescribedangles respectively. Hence, the inclination angles of the stages 6 and 7against the rectangular frame portion 11 depend upon the bend angles ofthe bent portions 31 a and 32 a respectively.

As described above, the second sides 6 f and 7 f of the stages 6 and 7are both moved in the same thickness direction of the rectangular frameportion 11 and are mutually inclined to each other at prescribed angles.That is, the stages 6 and 7 are mutually inclined upon rotation about anaxial line along the arranging direction thereof.

Furthermore, easy-to-deform portions 31 b are formed at prescribedpositions of the leads 31 in proximity to the first side 6 e of thestage 6 as well as at other positions of the leads 31 in proximity tothe rectangular frame portion, so that the bent portions 31 a aresandwiched between pairs of easy-to-deform portions 31 b respectively.Similarly, easy-to-deform portions 32 b are formed at prescribedpositions of the leads 32 in proximity to the first side 7 e of thestage 7 as well as at other positions of the leads 32 in proximity tothe rectangular frame portion 11, so that the bent portions 32 a aresandwiched between pairs of easy-to-deform portions 32 b respectively.All the easy-to-deform portions 31 b and 32 b are specifically shaped byphoto-etching, so that as shown in FIG. 16, they are formed to haveroughly half the thickness compared with other portions of the leads 31and 32.

The aforementioned lead frame 30 is placed on a planar surface H1 of ametal mold H as shown in FIG. 17, and a damper I is used to presssurfaces 6 d and 7 d of the stages 6 and 7 in proximity to the secondsides 6 f and 7 f. Herein, a hollow H2 is formed on the surface H1 ofthe metal mold H, so that the bent portions 31 a and 32 a of the leads31 and 32 are forced so as to be inserted into the hollow H2, thuspreventing them from being further deformed. At this time, theeasy-to-deform portions 31 b and 32 b of the leads 31 and 32 are broughtinto contact with edge portions of the hollow H2 and are subjected toelastic deformation. Thus, the surfaces 6 d and 7 d of the stages 6 and7 are forced so as to be arranged along the surface H1 of the metal moldH.

In the aforementioned condition, the magnetic sensor chips 2 and 3 arerespectively bonded onto the surfaces 6 d and 7 d of the stages 6 and 7by using silver paste; then, they are wired with the leads 4. Aftercompletion of hardening of the silver paste, the damper I is releasedthe stages 6 and 7, whereby the easy-to-deform portions 31 b and 32 b ofthe leads 31 and 32 are restored from the elastically deformed statesthereof, so that the stages 6 and 7 are restored to the inclined statesthereof.

Then, the hold mechanism 100 holds the stages 6 and 7 so as to beinclined at prescribed angles respectively. Lastly, a molded resincasing is formed to encapsulate the magnetic sensor chips 2 and 3therein; then, unwanted portions such as the rectangular frame portion11 are cut, thus completing the manufacture of the magnetic sensor.

In the second modified example described above, both the press workingand bending working are simultaneously performed by using the same metalmold; therefore, it is possible to simplify the steps in the manufactureof the magnetic sensor. Due to elastic deformation of the easy-to-deformportions 31 b and 32 b of the leads 31 and 32, the stages 6 and 7 can besubstantially placed in the same plane; therefore, it is possible tosimultaneously bond a plurality of magnetic sensor chips onto aplurality of stages with ease, which in turn contributes to a reductionof the manufacturing cost of the magnetic sensor.

In the manufacture of the lead frame 30, the stages 6 and 7 areinclined, and the hold mechanism 100 holds them so as not to be restoredtowards the frame 9. Therefore, it is possible to accurately set aprescribed angle formed between the surfaces 2 a and 3 a of the magneticsensor chips 2 and 3 with ease.

Incidentally, the aforementioned hold mechanism 100 is constituted suchthat the projection 15 b formed on the lower end surface 15 a of theprojecting portion 15 is inserted into the hollow 14 b of the lead 14,but this is not restrictive. Therefore, it is possible to modify thefirst embodiment in such a way that the lead 14 and the projectingportion 15 have projections respectively, for example, because it isrequired that the lead 14 and the projecting portion 15 somewhat overlapin position in the thickness direction of the lead frame 10.

The hold mechanism 100 is designed to hold the stages 6 and 7 ininclined states at prescribed angles respectively. If the stages 6 and 7can be stabilized in inclined states at prescribed angles respectivelyeven when ends 13 a and 21 a of the leads 13 and 21, the easy-to-deformportions 12 b, 22 c, 31 b, and 32 b of the leads 12, 22, 31, and 32, andthe bent portions 22 b of the leads 22 are restored from the elasticallydeformed states, it is unnecessary to provide the hold mechanism 100.

In addition, the easy-to-deform portions 12 b, 22 c, 31 b, and 32 b areeach subjected to photo-etching so as to have roughly half the thicknesscompared with other portions of the leads 12, 22, 31, and 32, but thisis not restrictive. That is, it is possible to arbitrarily determine thethickness of the easy-to-deform portions, or it is possible to partiallychange the thickness of the leads. Alternatively, it is possible toarrange notches on the leads without changing the thickness, or it ispossible to form through holes at prescribed positions of the leads. Inshort, it is required that the leads 12, 22, 31, and 32 can beelastically deformed at prescribed positions with ease.

A third modified example of the first embodiment will be described withreference to FIGS. 18 to 21, wherein parts identical to those shown inFIGS. 1 to 8 are designated by the same reference numerals; hence, thedetailed description thereof will be omitted.

Prior to the manufacture of a magnetic sensor, a thin metal plate issubjected to press working, photo-etching, and bending working by usingthe same metal mold, thus producing a lead frame 40 including two stages6 and 7, which are supported by a frame 39 as shown in FIG. 18. The leadframe 40 has a plurality of leads 4, and 41 to 44 that are inwardlyprojected from a rectangular frame portion 11.

The leads 41 and 42 are hanging leads for fixing the stages 6 and 7 tothe rectangular frame portion 11 at prescribed positions, and the lead41 is interconnected with a first side 6 e of the stage 6, while thelead 42 is interconnected with a first side 7 e of the stage 7.

A pair of leads (or pressing members) 43 and 44 are projected from therectangular frame portion 11 towards a second side 6 f opposite thefirst side 6 e of the stage 6, and a pair of leads (or pressing members)43 and 44 are projected from the rectangular frame portion 11 towards asecond side 7 f opposite the first side 7 e of the stage 7.

As shown in FIG. 19, tip ends of the leads 43 are arranged in contactwith surfaces 6 d and 7 d of the stages 6 and 7 in proximity to ends 6 aand 7 a respectively, while tip ends of the leads 44 are arranged incontact with backsides 6 c and 7 c of the stages 6 and 7 in proximity toother ends 6 b and 7 b respectively. Under this condition, the surfaces6 d and 7 d of the stages 6 and 7 are pressed downwardly due toelasticity of the leads 43, while the backsides 6 c and 7 c of thestages 6 and 7 are pressed upwardly due to elasticity of the leads 44.For this reason, the stages 6 and 7 are placed under the influence offorces causing rotations about axial lines interconnected between thefirst sides 6 e and 7 e, and the second sides 6 f and 7 f respectively.Due to such forces, easy-to-deform portions 41 a and 42 a of the leads41 and 42 are subjected to elastic deformation and are distorted, sothat the stages 6 and 7 are inclined respectively. That is, the stages 6and 7 are inclined such that the other ends 6 b and 7 b thereof aremoved in the same thickness direction of the rectangular frame portion11.

Then, as shown in FIGS. 20 and 21, dampers J and K are brought intocontact with the leads 43 and 44, which are thus spaced apart from thestages 6 and 7 respectively. At this time, the stages 6 and 7 arereleased from pressures applied thereto by the leads 43 and 44, so thatthe easy-to-deform portions 41 a and 42 a are restored from theelastically deformed states thereof. Therefore, both the stages 6 and 7are placed substantially in the same plane of the rectangular frameportion 11 in the lead frame 40.

In the aforementioned condition, magnetic sensor chips 2 and 3 arerespectively bonded onto the surfaces 6 d and 7 d of the stages 6 and 7by use of silver paste, and they are wired with the leads 4. Aftercompletion of hardening of the silver paste, the leads 43 and 44 arereleased from pressures applied thereto by the dampers J and K. Thus,the leads 43 again press the surfaces 6 d and 7 d of the stages 6 and 7,and the leads 44 again press the backsides 6 c and 7 c of the stages 6and 7. This causes the easy-to-deform portions 41 a and 42 a to beelastically deformed, by which the stages 6 and 7 are inclined again.

Lastly, a molded resin casing is formed to encapsulate the magneticsensor chips 2 and 3 in a resin; then, unwanted portions such as therectangular frame portion 11 are cut, thus completing the manufacture ofthe magnetic sensor.

In the aforementioned manufacturing method, the leads 43 and 44 forinclining the stages 6 and 7 are formed in a manufacturing process ofthe lead frame 40; therefore, after wiring the magnetic sensor chips 2and 3 together with the leads 4, it is possible to easily incline thestages 6 and 7. That is, it is possible to simplify the manufacture ofthe magnetic sensor. In addition, the dampers J and K are used toseparate the leads 43 and 44 from the stages 6 and 7 so that theeasy-to-deform portions 41 a and 42 a of the leads 41 and 42 arerestored from the elastically deformed states thereof, whereby thestages 6 and 7 are placed substantially in the same plane. This allows aplurality of magnetic sensor chips to be simultaneously bonded onto aplurality of stages with ease. Thus, it is possible to reduce themanufacturing cost of the magnetic sensor.

Due to the provision of the leads 43 and 44, the stages 6 and 7 can bereliably maintained in inclined states; therefore, it is possible toaccurately set the prescribed angle between surfaces 2 a and 3 a of themagnetic sensor chips 2 and 3 with ease.

In the aforementioned examples related to the first embodiment, themagnetic sensor ships 2 and 3 are bonded onto the stages 6 and 7 by useof the silver paste, but this is not restrictive. That is, anyconductive adhesive may satisfy the need for bonding the magnetic sensorchips 2 and 3 onto the stages 6 and 7.

In addition, the magnetic sensor chips 2 and 3 are bonded onto thesurfaces 6 d and 7 d of the stages 6 and 7, but this is not restrictive.That is, at least one magnetic sensor chip can be bonded onto thebackside (6 c or 7 c) of the stage (6 or 7).

Furthermore, the magnetic sensor uses two magnetic sensor chips 2 and 3,wherein the magnetic sensor chip 3 has a single sensing direction, butthis is not restrictive. That is, it is possible to use a plurality ofmagnetic sensor chips to realize three or more sensing directions, whichcross each other so as to allow a magnetism direction to be expressed asa vector in a three-dimensional space. For example, the magnetic sensorchip 3 can be modified to have two sensing directions. Alternatively, itis possible to use three magnetic sensor chips each having a singlesensing direction.

In the above, the backsides 4 a of the leads 4 are exposed below thelower surface 5 a of the molded resin casing 5, but this is notrestrictive. For example, the backsides 4 a of the leads 4 can bepartially arranged below the lower surface 5 a of the molded resincasing 5.

This invention is not necessarily limited to the aforementioned examplesrelated to the first embodiment in terms of the number and positions ofthe leads 4 and wires 8. That is, in response to the types of magneticsensor chips, it is possible to arbitrarily change the number andpositions of wires being bonded to the magnetic sensor chips, and it ispossible to arbitrarily change the number and positions of the leads.

Moreover, the aforementioned magnetic sensor 1 is designed to allowinstallation into a portable terminal device, but this is notrestrictive. For example, the magnetic sensor 1 can be redesigned formedical instruments such as catheters, fiberscopes, and cameras that areinserted into human bodies. In order to measure bearings of a camerathat is inserted into a human body, the human body is placed under theinfluence of a magnetic field so that a magnetism direction is measuredby the magnetic sensor 1. Therefore, it is possible to determine arelative angle between the magnetic sensor and the magnetic field in athree-dimensional manner. Thus, it is possible to accurately detectbearings of a camera with reference to the magnetism direction.

As described heretofore, the first embodiment and its related exampleshave a variety of effects and technical features, which will bedescribed below.

(1) A lead frame adapted to a magnetic sensor comprises at least twostages and interconnecting members having elastically deformingabilities, so that various types of magnetic sensors can be manufacturedwith ease by adequately setting positional relationships betweenmagnetic sensor chips mounted on stages.

(2) Bent portions that can be bent upon plastic deformation are formedin the interconnecting members, which allow the stages to be arranged atdesired positions with ease. Specifically, easy-to-deform portions thatcan be elastically deformed are formed in the interconnecting memberswith ease; therefore, it is possible to easily and simultaneously bondmagnetic sensor chips onto the stages, the surfaces of which aresubstantially placed in the same plane.

(3) A first projecting portion (e.g., a lead) is projected inwardly froma frame of the lead frame, while a second projecting portion isprojected from a stage. That is, the lead frame has first and secondprojecting portions, which are projected in opposite directions inproximity to each other and partially overlap each other in thethickness direction. Upon engagement of the first and second projectingportions, it is possible to prevent stages, once arranged at desiredpositions by adequately bending the bent portions, from being returnedto the frame. Thus, it is possible to reliably fix sensor chips atdesired positions.

(4) The stages are automatically inclined during the manufacture of thelead frame due to the provision of easy-to-deform portions in theinterconnecting members, wherein a plurality of magnetic sensor chipscan be simultaneously bonded onto the stages that are pressed bypressing members and are placed substantially in the same plane. Due tothe provision of pressing members, the stages can be maintained atprescribed positions; therefore, it is possible to accurately set aprescribed angle between the surfaces of the magnetic sensor chips.

(5) In the manufacture of the magnetic sensor, it is possible tosimultaneously bond a plurality of magnetic sensor chips onto aplurality of stages, which are inclined and are placed substantially inthe same plane as necessary; therefore, it is possible to reduce thenumber of steps in the manufacture of the magnetic sensor; thus, it ispossible to reduce the manufacturing cost of the magnetic sensor.

(6) It is possible to accurately set a desired angle formed between thesurfaces of the magnetic sensor chips with ease. When one magneticsensor chip has two sensing directions while the other magnetic sensorchip has a single sensing direction, it is possible to accuratelymeasure bearings of magnetism, which can be determined as a vector in athree-dimensional space.

(7) The stages can be maintained in inclined states so as not to returntowards the frame; therefore, it is possible to reliably fix themagnetic sensor chips inclined at prescribed angles respectively.

(8) In the manufacture of the magnetic sensor, the pressing members areformed so as to incline the stages; therefore, it is possible tosimplify the manufacturing process of the magnetic sensor. In addition,a plurality of magnetic sensor chips can be simultaneously bonded onto aplurality of stages with ease; therefore, it is possible to reduce themanufacturing cost of the magnetic sensor.

2. Second Embodiment

First, a description will be given with respect to the configuration ofa magnetic sensor 101 that is manufactured by a manufacturing methodaccording to a second embodiment of the invention with reference toFIGS. 22 and 23. Similar to the foregoing magnetic sensor 1 of the firstembodiment, the magnetic sensor 101 of the second embodiment is designedto measure the direction and magnitude of an external magnetic fieldapplied thereto, and it comprises two magnetic sensor chips 102 and 103,a plurality of leads 104 for electrically connecting the magnetic sensorchips 102 and 103 with an external device (not shown), and a moldedresin casing 105 for encapsulating and integrally fixing the magneticsensor chips 102 and 103 and the leads 104 at prescribed positionstherein.

Each of the magnetic sensor chips 102 and 103 is roughly formed in arectangular plate-like shape in plan view, and they are mounted onstages 106 and 107 respectively. The magnetic sensor chips 102 and 103are embedded in the molded resin casing 105, wherein they are arrangedabove the leads 104 and in proximity to an upper surface 105 c of themolded resin casing 105. In addition, the magnetic sensor chips 102 and103 are respectively inclined towards a lower surface 105 a of themolded resin casing 105, wherein ends 102 b and 103 b of the magneticsensor chips 102 and 103 are directed towards the upper surface 105 c ofthe molded resin casing 105, so that surfaces 102 a and 103 a of themagnetic sensor chips 102 and 103 are mutually inclined at an acuteangle θ therebetween. That is, the acute angle θ is formed between asurface 106 d of the stage 106 and a backside 107 c of the stage 107.

In the above, the magnetic sensor chip 102 is sensitive to components ofmagnetism of an external magnetic field in two directions (namely,directions A and B), which cross at a right angle along the surface 102a thereof. In contrast, the magnetic sensor chip 103 is sensitive tocomponents of magnetism of an external magnetic field in a singledirection (namely, a direction C), which crosses at an acute angle to anA-B plane defined by the directions A and B along the surface 103 athereof.

The leads 104 are each made of a prescribed metal material such ascopper, and backsides 104 a of the leads 104 are exposed below the lowersurface 105 a of the molded resin casing 105. Ends 104 b of the leads104 are electrically connected with the magnetic sensor chips 102 and103 via wires 108, and interconnecting portions therebetween areembedded in the molded resin casing 105.

Next, a manufacturing method of the magnetic sensor 101 will bedescribed in accordance with the second embodiment of the invention.

First, a thin metal plate is subjected to either press working oretching, or it is subjected to both press working and etching; thus, itis possible to form a lead frame 110 as shown in FIGS. 24 and 25 inwhich the stages 106 and 107 are supported by a frame 109. The frame 109comprises a rectangular frame portion 111 that is formed s as toencompass the stages 106 and 107 therein, and a plurality of leads 104and 112 that project inwardly from the rectangular frame portion 111.

The leads 112 are hanging leads that fix the stages 106 and 107 relativeto the rectangular frame portion 111, wherein ends 112 a of the leads112 (namely, interconnecting members) are interconnected with side endsof first sides 106 a and 107 a of the stages 106 and 107 along the widthdirections. In addition, cutouts are formed at side positions of ends112 a of the leads 112, by which the widths are reduced compared withother portions of the leads 112. That is, ends 112 a of the leads 112have distorted portions that can be easily distorted and deformed whenthe stages 106 and 107 are inclined.

A pair of projecting elements 113 are formed in a backside 106 c of thestage 106 relative to a second side 106 b, and a pair of projectingelements 114 are formed in a backside 107 c of the stage 107 relative toa second side 107 b. The projecting elements 113 and 114 are arranged soas to incline the stages 106 and 107 respectively. Each of theprojecting elements 113 and 114 is formed in a thin rod-like shape,wherein the projecting elements 113 for the stage 106 are arrangedopposite the projecting elements 114 for the stage 107.

The projecting elements 113 that are formed along side ends of the stage106 with a prescribed distance therebetween are spaced apart from theprojecting elements 114 that are formed along side ends of the stage 107with a prescribed distance therebetween, whereby it is possible toprevent defects from occurring in the supply of a resin during theformation of a molded resin casing 105. In order to accurately inclinethe stages 106 and 107 in a stable manner, it is preferable to increasethe distance between the projecting elements 113 and the distancebetween the projecting elements 114. In addition, the projectingelements 113 and 114 have ‘circular’ tip ends 113 a and 114 a eachhaving a hemispherical shape in order to minimize unwanted exposure ofthe projecting elements 113 and 114 below the lower surface of themolded resin casing 105.

The internal areas of the lead frame 110 including the stages 106 and107 inside of the leads 104 are made thin compared with other areas ofthe lead frame 110 during application of photo-etching, and they areformed to have roughly half the thickness compared with the other areas,for example. The photo-etching is performed prior to press workingeffected on a thin metal plate in order to avoid unwanted exposure ofthe leads 112, and the backsides 106 c and 107 c of the stages 106 and107 below the lower surface of the molded resin casing 105.

After preparation of the lead frame 110, the magnetic sensor chips 102and 103 are respectively bonded onto the surfaces 106 d and 107 d of thestages 106 and 107; then, wires 108 are arranged so as to electricallyconnect the magnetic sensor chips 102 and 103 with the leads 104.

During the step of inclining the stages 106 and 107, bonded portionsbetween the wires 108 and the magnetic sensor chips 102 and 103 areseparated from bonded portions between the wires 108 and the leads 104.For this reason, the wires 108 should be arranged to have sufficientroom in length or height.

As shown in FIG. 26, the frame 109,.except for prescribed parts of theleads 104 and 112 is held and fixed in a metal mold consisting of anupper mold Dm and a lower mold Em, by which the magnetic sensor chips102 and 103 are embedded in a resin.

When the frame 109 is held in the metal mold, an interior wall E1 of thelower mold Em presses the tip ends 113 a and 114 a of the projectingelements 113 and 114 so that the stages 106 and 107 are respectivelyrotated about axial lines, which interconnect together ends 112 a of theleads 112 arranged on side ends of the stages 106 and 107, whereby ends112 a of the leads 112 are distorted and deformed. Thus, as shown inFIG. 27, the magnetic sensor chips 102 and 103 are inclined atprescribed angles against the leads 112 and against the interior wall E1together with the stages 106 and 107.

Under the condition where the tip ends 113 a and 114 a of the projectingelements 113 and 114 are pressed by the interior wall E1 of the lowermold Em, a melted resin material is injected into the metal moldconsisting of the upper mold Dm and the lower mold Em, thus forming amolded resin encapsulating the magnetic sensor chips 102 and 103.Therefore, it is possible to fixedly arrange the magnetic sensor chips102 and 103, which are mutually inclined at prescribed angles, in themolded resin.

Thereafter, unwanted parts such as the rectangular frame portion 111 andthe leads 112, which are projected outside of the molded resin, are cutso as to complete the manufacture of the magnetic sensor 101 shown inFIG. 22.

The magnetic sensor 101 is mounted on a board (or a substrate) arrangedinside of a portable terminal device (not shown), for example, in whichbearings of magnetism measured by the magnetic sensor 101 are displayedon a display screen.

Similar to the foregoing first embodiment, the magnetic sensor chips 102and 103 detect components of magnetism in directions A, B, and C so asto produce values Sa, Sb, and Sc approximately in proportion to thedetected components of magnetism. Details have already been describedwith reference to FIG. 9 in conjunction with the first embodiment. Thus,the second embodiment provides similar effects of the foregoing firstembodiment.

In the second embodiment, the projecting elements 113 and 114 have‘hemispherical’ tip ends 113 a and 114 a, but this is not restrictive.That is, it is required that the tip ends of the projecting elements 113and 114 have desired shapes to minimize exposure thereof below the lowersurface 105 a of the molded resin casing 105. Therefore, each of the tipends 113 a and 114 a of the projecting elements 113 and 114 can beformed in a sharp-pointed shape, for example.

In addition, it is possible to arrange insulators on the tip ends 113 aand 114 a of the projecting elements 113 and 114, by which metal partsof the tip ends 113 a and 114 a can be prevented from being exposedbelow the lower surface 105 a of the molded resin casing 105.Furthermore, it is possible to form the lower surface 105 a of themolded resin casing 105 in a convex shape, by which the tip ends 113 aand 114 a can be prevented from being exposed from the lowermost surfaceof the molded resin casing 105.

In the above, the projecting elements 113 are arranged opposite eachother along side ends of the stage 106 relative to the second side 106b, while the projecting elements 114 are arranged opposite to each otheralong side ends of the stage 107 relative to the second side 107 b, butthis is not restrictive. For example, as shown in FIGS. 28 and 29, it ispossible to alternately arrange projecting elements 113 and 114 alongthe width directions of the stages 6 and 7. Due to the alternatearrangement of the projecting elements 113 and 114, it is possible toreduce a gap between the stages 106 and 107 that are arranged so as toadjoin together. Therefore, it is possible to reduce the overall size ofthe magnetic sensor 101 without changing the sizes of the magneticsensor chips 102 and 103 mounted on the stages 106 and 107.

In the second embodiment, each of the projecting elements 113 and 114 isformed in a thin rod-like shape, but this is not restrictive. Forexample, as shown in FIGS. 30 and 31, a tapered projecting element 113for the stage 106 is engaged with a tapered projecting element 114 forthe stage 107 with prescribed gaps therebetween, and the projectingelement 113 has tapered shapes whose dimensions are gradually reducedfrom bases 113 b towards tip ends 113 a, and the projecting element 114has tapered shapes whose dimensions are gradually reduced from bases 114b to tip ends 114 a. Herein, it is possible to increase the dimensionsof the bases 113 b and 114 b of the projecting elements 113 and 114 soas to be relatively large; therefore, it is possible to prevent theprojecting elements 113 and 114 from being unexpectedly deformed whenthe stages 106 and 107 are inclined.

In addition, it is possible to arrange projecting elements 113 and 114linearly symmetrical with each other with respect to a center line A1,drawn through the centers of the stages 106 and 107 in the widthdirections, while increasing the width dimensions of the projectingelements 113 and 114 as shown in FIG. 32. Herein, when the stages 106and 107 are inclined, it is possible to prevent the projecting elements113 and 114 from being deformed, and it is therefore possible to preventthe stages 106 and 107 from being distorted. Since the width dimensionsof the projecting element 113 for the stage 106 are increased, it ispossible to arrange only the projecting element 113.

In the second embodiment, the projecting elements 113 and 114 arerespectively projected from the second sides 106 b and 107 b of thestages 106 and 107, but this is not restrictive. For example, as shownin FIG. 33, it is possible to arrange projecting elements 115 and 116,which are projected from side ends relative to the second side 106 b ofthe stage 106, and to arrange projecting elements 117 and 118, which areprojected from side ends relative to the second side 107 b of the stage107. Particularly, when two or more projecting elements (115-118) arearranged on side ends of the stages 106 and 107 in parallel, it ispossible to prevent the stages 106 and 107 from being deflected when thestages 106 and 107 are inclined upon pressure applied thereto by a metalmold Em.

In the above, the projecting elements 113 are projected in the backsides106 c and 107 c of the stages 106 and 107 relative to the second sides106 b and 107 b, but this is not restrictive. Herein, it is requiredthat the projecting elements 113 be projected from the stages 106 and107 either in the backsides 106 c and 107 c or in the surfaces 106 d and107 d. For example, it is possible to modify the second embodiment asshown in FIG. 35 in which projecting elements 119 and 120 are projectedin the surfaces 106 d and 107 d of the stages 106 and 107 relative tothe first sides 106 a and 107 a.

In FIG. 35, when the frame 109 is held between the upper mold Dm and thelower mold Em, tip ends 119 a and 120 a of the projecting elements 119and 120 are pressed by an interior wall D1 of the upper mold Dm so thatthe stages 106 and 107 are respectively rotated about axial lines, whichinterconnect together ends 112 a of the leads 112 on both sides of thestages 106 and 107, whereby ends 112 a of the leads 112 are distortedand deformed.

A magnetic sensor that is manufactured as shown in FIG. 35 ischaracterized in that the tip ends 119 a and 120 a of the projectingelements 119 and 120 are not exposed below the lower surface of a moldedresin because they do not come in contact with an interior wall E1 ofthe lower mold Em. This allows wiring to be arranged on the surface of aboard (or a substrate) mounting a magnetic sensor arranged inside of aportable terminal device, which can be thus manufactured with ease.

It is possible to modify the second embodiment as shown in FIG. 36 inwhich projecting elements 113 and 114 are projected in the backsides 106c and 107 c of the stages 106 and 107 relative to the second sides 106 band 107 b, and other projecting elements 119 and 120 are projected inthe surfaces 106 d and 107 d of the stages 106 and 107 relative to thefirst sides 106 a and 107 a.

In the above, when the frame 109 is sandwiched between the upper mold Dmand the lower mold Em under pressure, tip ends 113 a and 114 a of theprojecting elements 113 and 114 are pressed by the interior wall E1 ofthe lower mold Em while tip ends 119 a and 120 a of the projectingelements 119 and 120 are pressed by the interior wall D1 of the uppermold Dm. This increases the forces for rotating the stages 106 and 107.Therefore, it is possible to easily handle the lead frame 110 byemploying strong structures for ends 112 a of the leads 112 in themanufacture of the magnetic sensor 101.

In addition, both the projecting elements 113, 114, 119, and 120 can beformed by etching, wherein parts of the lead frame 110 other than theprojecting elements 113, 114, 119, and 120 are made relatively thin byetching, for example.

The aforementioned projecting elements 113 and 114 are not necessarilyprojected from side ends of the first sides 106 a and 107 a or from sideends of the second sides 106 b and 107 b of the stages 106 and 107respectively. That is, it is possible to modify the lead frame 110 asshown in FIGS. 37 and 38 in which cutting lines each having arectangular U-shape are drawn in the stages 106 and 107, so thatrectangular U-shaped areas encompassed by the cutting lines aresubjected to bending working so as to form projecting elements 121 and122 respectively.

In the above, when the magnetic sensor chips 102 and 103 are arranged onthe surfaces 206 d and 207 d of the stages 206 and 207, it is requiredthat the projecting elements 121 and 122 be projected in the backsides106 c and 107 c of the stages 106 and 107 respectively. Herein, theprojecting elements 121 and 122 are not projected externally from thestages 106 and 107; therefore, even when the magnetic sensor chips 102and 103, and the stages 106 and 107 are increased in area, it ispossible to reduce the overall size of the magnetic sensor.

In the second embodiment and its related examples, the projectingelements 113, 114, 119 to 122 are each integrally made of the thin metalplate constructing the lead frame 110, but this is not restrictive. Forexample, when the magnetic sensor chips 102 and 103 are mounted on thesurface 106 d and 107 d of the stages 106 and 107 respectively,projecting elements that are formed independently of the thin metalplate of the lead frame 110 are attached to the backsides 106 c and 107c of the stages 106 and 107. That is, as shown in FIGS. 39 and 40, it ispossible to independently produce projecting elements 123 and 124, eachhaving a roughly rectangular parallelopiped shape, which are made of thesame material of the lead frame 110, whereby the projecting elements 123and 124 are bonded onto the backsides 106 c and 107 c of the stages 106and 107 respectively.

Each of the projecting elements 123 and 124 is not necessarily formed ina rectangular parallelopiped shape; therefore, it can be formed in aspherical shape or hemispherical shape. Alternatively, the projectingelements 123 and 124 bonded onto the backsides 106 c and 107 c of thestages 106 and 107 can have sharp-pointed tip ends.

In the above, the projecting elements 123 and 124 can be bonded onto thestages 106 and 107 by electric welding or by ultrasonicthermocompression bonding, for example. The ultrasonic thermocompressionbonding is effected by frictional heat energy due to ultrasonic waves orupon heat energy and weight. Prior to the aforementioned bonding, it ispreferable to remove surface oxide films from the stages and the like.Bonding effected between the projecting elements 123 and 124 and thestages 106 and 107 is not necessarily limited to the aforementionedmethods. For example, it is possible to use adhesive tape, adhesiveagent, and solder.

The projecting elements 123 and 124 are not necessarily bonded onto thebacksides 106 c and 107 c of the stages 106 and 107. For example, thebacksides 106 c and 107 c of the stages 106 and 107 are subjected toplating, by which the projecting elements 123 and 124 are formed.Alternatively, the backsides 106 c and 107 c of the stages 106 and 107are subjected to etching, by which parts corresponding to the projectingelements 123 and 124 are formed.

In the second embodiment, ends 112 a of the leads 112 are connected withside ends of the first sides 106 a and 107 a of the stages 106 and 107,but this is not restrictive. Herein, it is required that ends 112 a ofthe leads 112 be located at prescribed positions allowing the stages 106and 107 to be inclined at prescribed angles. For example, as shown inFIG. 41, ends 112 a of the leads 112 are connected with side ends of thesecond sides 106 b and 107 b of the stages 106 and 107, so thatprojecting elements 125 and 126 allowing the stages 106 and 107 to beinclined are formed in the first sides 106 a and 107 a of the stages 106and 107. In this case, the second sides 106 b and 107 b act as centersof rotation of the stages 106 and 107.

In the second embodiment, ends 112 a of the leads 112 have cutouts, butthis is not restrictive. That is, it is required that they are distortedwhen the stages 106 and 107 are inclined. In addition, ends 112 a of theleads 112 are distorted and deformed when the stages 106 and 107 areinclined, but this is not restrictive. That is, it is required that theleads 112 support the stages 106 and 107, which are subjected to plasticdeformation and/or elastic deformation and are therefore inclined withease.

In the second embodiment, the stages 106 and 107 are inclined uponrotation about axial lines connecting between ends 112 a of the leads112, but this is not restrictive. That is, it is required that thestages 106 and 107 be mutually inclined, thus securing the sensingdirection of the magnetic sensor chip 103 to cross the A-B plane definedby two sensing directions of the magnetic sensor chip 102.

Therefore, it is possible to modify the lead frame 110 as shown in FIG.42, in which ends 112 a of the leads 112 are arranged on side ends ofthe stages 106 and 107 respectively, and projecting elements 127 and 128are arranged on the other side ends of the stages 106 and 107respectively. When pressing the projecting elements 127 and 128 by ametal mold (not shown), the stages 106 and 107 are inclined uponrotation about an axial line drawn in a direction for arranging thestages 106 and 107 in line, so that ends 112 a of the leads 112 are bentand subjected to plastic deformation and/or elastic deformation.

In the second embodiment, the stages 106 and 107 are inclined due to thefunctions of the projecting elements 113, 114, 119, and 120, but this isnot restrictive. That is, it is required that any projecting elementscausing inclination of the stages 106 and 107 be projected in thesurfaces 106 d and 107 d or in the backsides 106 c and 107 c of thestages 106 and 107 respectively.

For example, as shown in FIG. 43, it is possible to form projectingelements 112 b, which are projected in the backsides 106 c and 107 c ofthe stages 106 and 107, in the leads 112 for supporting the stages 106and 107. The projecting elements 112 b are partially held betweeninterior walls D2 and E2 of an upper mold Dm and a lower mold Emtogether with the leads 104 as well as the other leads 112, wherein ends112 a, which are deformed in order to incline the stages 106 and 107,are formed in the other leads 112 other than the leads 112 having theprojecting elements 112 b and are interconnected with the second sides106 b and 107 b of the stages 106 and 107 respectively.

In the above, when the projecting elements 112 b are partiallysandwiched between the molds Dm and Em, they are pressed upwards so thatthe first sides 106 a and 107 a of the stages 106 and 107 are rotatedabout the second sides 106 b and 107 b, and they are moved upwards asshown in FIG. 24.

3. Third Embodiment

A description will be given with respect to the configuration of amagnetic sensor that is manufactured by a manufacturing method accordingto a third embodiment of the invention with reference to FIGS. 45 and46, wherein a magnetic sensor 201 is designed to measure the directionand magnitude of magnetism of an external magnetic field appliedthereto. The magnetic sensor 201 comprises two magnetic sensor chips 202and 203, a plurality of leads 204 for electrically connecting themagnetic sensor chips 202 and 203 with an external device (not shown),and a molded resin casing 205 for encapsulating the magnetic sensorchips 202 and 203 and the leads 204, which are integrally fixed atprescribed positions, in a resin.

Each of the magnetic sensor chips 202 and 203 is formed roughly in arectangular plate-like shape in plan view, and they are respectivelymounted on stages 206 and 207. The magnetic sensor chips 202 and 203 areboth embedded in the molded resin casing 205, wherein they are arrangedabove bases 204 a of the leads 204 in proximity to an upper surface 205c of the molded resin casing 205. In addition, the magnetic sensor chips202 and 203 are respectively inclined at prescribed angles against alower surface 205 a of the molded resin casing 205, and ends 202 b and203 b of the magnetic sensor chips 202 and 203 are directed towards theupper surface 205 c of the molded resin casing 205; that is, themagnetic sensor chips 202 and 203 are mutually inclined to each other insuch a way that an acute angle θ is formed between surfaces 202 a and203 a thereof. Herein, the acute angle θ is formed between a surface 206a of the stage 206 and a backside 207 b of the stage 207.

The magnetic sensor chip 202 is sensitive to components of magnetismwith respect to an external magnetic field in two directions (namely,directions A and B), which cross at a right angle along the surface 202a thereof. The magnetic sensor chip 203 is sensitive to components ofmagnetism with respect to an external magnetic field in a singledirection (namely, a direction C), which crosses at an acute angle tothe A-B plane defined by the directions A and B.

Each of the leads 204 is made of a prescribed metal material such ascopper, and it comprises a base 204 a, a tip end 204 b, and aninterconnecting portion 204 c for interconnecting between the base 204 aand the tip end 204 b, and it has a crank-like sectional shape, forexample.

The bases 204 a of the leads 204 are partially embedded in the moldedresin casing 205 and are electrically connected with the magnetic sensorchips 202 and 203 via wires 208. Both the tip ends 204 b andinterconnecting portions 204 c of the leads 204 are arranged outside ofside surfaces 205 b of the molded resin casing 205, and the tip ends 204b are arranged lower than the lower surface 205 a of the molded resincasing 205.

Next, a description will be given with respect to a manufacturing methodof the magnetic sensor 201 in accordance with the third embodiment ofthe invention.

A thin metal plate is subjected to either press working or etching, orit is subjected to both press working and etching, thus producing a leadframe 210 including stages 206 and 207 supported by a frame 209 as shownin FIGS. 47 and 48. The frame 209 comprises a rectangular frame portion211, which is formed in a rectangular shape in plan view forencompassing the stages 206 and 207, and a plurality of leads 204 and212 that are projected inwardly from the rectangular frame portion 211.

The leads 212 are hanging leads for fixing the stages 206 and 207 atprescribed positions relative to the rectangular frame portion 211,wherein ends 212 a and 212 b are arranged in proximity to side ends ofthe stages 206 and 207. Ends 212 a and 212 b of the leads 212 havespecific shapes allowing plastic deformation with ease when the stages206 and 207 are inclined.

Specifically, ends 212 a of the leads 212 are arranged in proximity tofirst sides 206 c and 207 c of the stages 206 and 207, and cutouts areformed at both sides of ends 212 a, which are thus reduced in widthcompared with other portions of the leads 212 and which can be easilydistorted. The other ends 212 b of the leads 212 are arranged inproximity to second sides 206 d and 207 d of the stages 206 and 207,whereby as shown in FIG. 49, they are subjected to bending working inadvance so that they are projected higher above surfaces 212 c of theleads 212 and can be therefore easily bent.

In the above, the stages 206 and 207 are arranged adjacent to each otherwith the first sides 206 c and 207 c thereof, while the second ends 206d and 207 d are arranged opposite the first ends 206 c and 207 c in thestages 206 and 207.

After preparation of the lead frame 210, as shown in FIGS. 47 and 48,magnetic sensor chips 202 and 203 are respectively bonded onto surfaces206 a and 207 a of the stages 206 and 207, which are then electricallyconnected with the leads 204 via wires 208. In the step for incliningthe stages 206 and 207, bonding portions between the wires 208 and themagnetic sensor chips 202 and 203 must be separated from bondingportions between the wires 208 and the leads 204; therefore, the wires208 are arranged so as to have sufficient room in length or heightthereof.

As shown in FIG. 50, the lead frame 210 is held between upper molds Dmand lower molds Em, except for the stages 206 and 207, and ends 212 aand 212 b of the leads 212. Then, pins F are used to press up backsides206 b and 207 b of the stages 206 and 207 relative to the second sides206 d and 207 d, so that the stages 206 and 207 are inclined atprescribed angles together with the magnetic sensor chips 202 and 203.

In the above, the stages 206 and 207 are respectively rotated aboutaxial lines (see dotted lines shown in FIG. 47) connecting between ends212 a of the leads 212, which are fixed to both side ends of the stages206 and 207, so that ends 212 a are distorted upon plastic deformation,while the other ends 212 b are bent upon plastic deformation. For thisreason, it is possible to maintain the magnetic sensor chips 202 and 203at inclined conditions against the bases 204 a of the leads 204.

The aforementioned lead frame 210 equipped with the magnetic sensorchips 202 and 203 are placed in another metal mold (not shown), intowhich a melted resin is injected so as to form a molded resin forencapsulating the magnetic sensor chips 202 and 203 therein. Thus, it ispossible to fixedly arrange the magnetic sensor chips 202 and 203mutually inclined to each other inside of a molded resin.

Lastly, the rectangular frame portion 211 is cut together with unwantedportions of the leads 212 that are projected outside of the moldedresin, thus completing the manufacture of the magnetic sensor 201 shownin FIG. 45.

The aforementioned magnetic sensor 201 is mounted on a board (or asubstrate) arranged inside of a portable terminal device (not shown), inwhich bearings of magnetism measured by the magnetic sensor 201 aredisplayed on a display screen.

That is, similar to the foregoing first embodiment, the magnetic sensorchips 202 and 203 detect components of magnetism in directions A, B, andC so as to produce values Sa, Sb, and Sc approximately in proportion tothe detected components of magnetism. Details have already beendescribed with reference to FIG. 9.

The third embodiment can be modified in a variety of ways; therefore,examples of modifications will be described below.

A modified example of the third embodiment will be described withreference to FIGS. 51 and 52, in which parts identical to those shown inFIGS. 45 and 46 are designated by the same reference numerals; hence,the detailed description thereof will be omitted as necessary.

Prior to the manufacture of a magnetic sensor, a thin metal plate issubjected to press working and etching, thus producing a lead frame 220including two stages 206 and 207 supported by a frame 219 as shown inFIG. 51. The frame 219 has a plurality of leads 204 and 221 that areprojected inwardly from a rectangular frame portion 211.

The leads 221 are hanging leads for fixing the stages 206 and 207 atprescribed positions relative to the rectangular frame portion 211, andends 221 a are fixed to both side ends of second sides 206 d and 207 dof the stages 206 and 207 respectively. Ends 221 a of the leads 221 areformed thinner than other portions of the leads 221, so that they can beeasily distorted.

A pair of stage interconnecting members 222 for interconnecting betweenthe stages 206 and 207 are projected from a first side 206 c of thestage 206 and are interconnected to a first side 207 c of the stage 207.Each of the stage interconnecting members 222 is formed in a zigzagshape lying in a plane perpendicular to the thickness direction of thelead frame 220, so that they can be subjected to plastic deformationwith ease.

After preparation of the lead frame 220, as shown in FIG. 52, magneticsensor chips 202 and 203 are bonded onto surfaces 206 a and 207 a of thestages 206 and 207; then, wires 208 are arranged between the magneticsensor chips 202 and 203 and the leads 204.

Then, the lead frame 220 is held between upper molds Gm and lower moldsHm, except for the stages 206 and 207, ends 221 a of the leads 221, andthe stage interconnecting members 222. In this condition, pins I areused to press up backsides 206 d and 207 d of the stages 206 and 207relative to the first sides 206 c and 207 c respectively, so that thestages 206 and 207 are inclined at prescribed angles together with themagnetic sensor chips 202 and 203.

In the above, the stages 206 and 207 are rotated about axial linesconnecting between pairs of ends 221 a of the leads 221, which arerespectively fixed to both side ends of the stages 206 and 207, so thatends 221 a of the leads 221 are distorted upon plastic deformation. Atthis time, the first sides 206 c and 207 c of the stages 206 and 207 aremutually separated from each other, so that the stage interconnectingmembers 222 are expanded upon plastic deformation. Thus, it is possibleto maintain the magnetic sensor chips 202 and 203 in inclined statesrelative to the bases 204 a of the leads 204.

Lastly, a molded resin is formed so as to encapsulate the magneticsensor chips 202 and 203 therein; then, the rectangular frame portion211 and unwanted portions of the leads 221 that are projected outside ofthe molded resin are cut, thus completing the manufacture of themagnetic sensor.

In the above, it is possible to simultaneously bond the magnetic sensorchips 202 and 203 onto the stages 206 and 207 of the lead frame 220 withease; therefore, it is possible to reduce the number of steps in themanufacture, and it is possible to reduce the manufacturing cost of themagnetic sensor.

Since the stage interconnecting members 222 are shaped so as to allowplastic deformation thereof with ease, when the pins I press up thebacksides 206 b and 207 b of the stages 206 and 207 relative to thefirst sides 206 c and 207 c, the stages 206 and 207 are subjected toplastic deformation so that they can be inclined against the frame 219with ease. Since ends 221 a of the leads 221 and the stageinterconnecting members 222 are subjected to plastic deformation, it ispossible to accurately set a prescribed angle formed between thesurfaces 202 a and 203 a of the stages 202 and 203 with ease.

In addition, each of the stage interconnecting members 222 is formed ina zigzag shape lying in a plane perpendicular to the thickness directionof the lead frame 220. Therefore, it is possible to produce the leadframe 220 with ease because it is unnecessary to perform bending workingand etching on the stage interconnecting members 222.

In the third embodiment, ends 212 b of the leads 212 are projected fromthe surfaces 212 c, but this is not restrictive. That is, it is requiredthat the leads 212 can be subjected to plastic deformation with easewhen the stages 206 and 207 are inclined. For example, as shown in FIG.53A, the leads 212 are subjected to bending working so that one end 212b is projected in both of the surface 212 c and the backside 212 d.Alternatively, as shown in FIG. 53B, the leads 212 are subjected toetching so that end 212 b is reduced in thickness compared with otherportions of the lead 212.

It is possible to further modify the leads 212 such that, as shown inFIG. 53C, a prescribed portion of the leads 212 is formed in a zigzagshape lying in a plane perpendicular to the thickness direction of thelead frame 210. In such a modification, it is unnecessary to performbending working or etching on the leads 212; therefore, it is possibleto produce the lead frame 210 having a zigzag portion 212 b with ease.Herein, it is preferable that the zigzag portion 212 b is reduced inthickness compared with other portions of the lead 212.

In the third embodiment, ends 212 a of the leads 212 are fixed to bothside ends of the stages 206 and 207 relative to the first sides 206 cand 207 c, but this is not restrictive. That is, it is required that thestages 206 and 207 can be rotated about the first sides 206 c and 207 cthereof. For example, as shown in FIG. 54, the first sides 206 c and 207c of the stages 206 and 207 are interconnected together via stageinterconnecting members 215, to which ends 212 a of the leads 212 arefixed.

In addition, the other ends 212 b of the leads 212 are not necessarilyfixed to both side ends of the stages 206 and 207 relative to the secondsides 206 d and 207 d. That is, they can be directly fixed to the secondsides 206 d and 207 d of the stages 206 and 207, for example.

In the third embodiment, the magnetic sensor chips 202 and 203 arerespectively inclined at prescribed angles such that one ends 202 b and203 b thereof are directed towards the upper surface 205 c of the moldedresin casing 205, but this is not restrictive. That is, the magneticsensor chips 202 and 203 are mutually inclined to each other against theframe 209 such that the sensing direction of the magnetic sensor chip203 crosses the A-B plane defined by the sensing directions of themagnetic sensor chip 202.

When the magnetic sensor chips 202 and 203 are changed in theinclination directions thereof, ends 212 a and 212 b of the leads 212should be correspondingly changed in positions in the lead frame 210.

Cutouts are not necessarily formed in ends 212 a of the leads 212. Thatis, they should be shaped to allow plastic deformation with ease whenthe stages 206 and 207 are inclined. In addition, bent portions of theleads 212 are not necessarily formed as ends 212 b of the leads 212 atprescribed positions proximate to the stages 206 and 207 respectively.For example, as shown in FIG. 55, a single stage interconnecting member222 can be formed so as to interconnect together the stages 206 and 207.The stage interconnecting member 222 is not necessarily formed in azigzag shape lying in the plane perpendicular to the thickness directionof the lead frame 220. That is, it should be shaped to allow plasticdeformation with ease.

For example, as shown in FIG. 56A, both the stages 206 and 207 areintegrally formed on a plate 223 roughly having a rectangular shape, inwhich a through hole 223 a is formed to partition between the stages 206and 207, which are thus bridged via interconnecting members 222. It ispossible to further modify the lead frame as shown in FIG. 56B such thattapered projections 224 and 225 are respectively projected from thefirst sides 206 c and 207 c of the stages 206 and 207, wherein they aregradually reduced in dimensions towards the tip ends, which are mutuallyinterconnected together.

Incidentally, it is possible to reduce the stage interconnecting members222 in thickness compared with the stages 206 and 207.

The stage interconnecting members 222 are not necessarily arranged so asto mutually interconnect together the first sides 206 c and 207 c of thestages 206 and 207. For example, as shown in FIG. 57, interconnectingmembers 222 are arranged so as to interconnect together both side endsof the stages 206 and 207 relative to the first sides 206 c and 207 crespectively. Herein, each of the interconnecting members 222 is formedin a fan-like shape, which allows plastic deformation with ease. In FIG.57, no interconnecting member is arranged in the gap between the stages206 and 207 that are arranged adjacent to each other; therefore, it ispossible to reduce the gap therebetween. In other words, it is possibleto reduce the overall size of the magnetic sensor by using theaforementioned lead frame.

The stage interconnecting members 222 that are fixed to side ends of thestages 206 and 207 are not necessarily formed in the aforementionedshapes. For example, as shown in FIG. 58, each of the stageinterconnecting members 222 can be formed in a rectangular frame-likeshape. Alternatively, it is possible to modify the stage interconnectingmembers 222 so as to be partially bent inwardly or outwardly as shown inFIGS. 59 and 60.

In addition, the stage interconnecting members 222 are not necessarilyarranged so as to directly interconnect together the stages 206 and 207.For example, as shown in FIG. 61, a rectangular frame portion 226 isarranged so as to interconnect between both side ends of the stage 206and to encompass the first end 206 c, while another rectangular frameportion 227 is arranged to interconnect between both side ends of thestage 207 and to encompass the first end 207 c, and they areinterconnected together via an interconnecting member 228.

The stage interconnecting members 222 are not necessarily arranged tomutually interconnect together the stages 206 and 207. For example, asshown in FIG. 62, they are interconnected with leads 229 that areprojected from the rectangular frame portion 211.

In the third embodiment and its related examples, pins F and I are usedto press up the stages 206 and 207 relative to the first sides 206 c and207 c and relative to the second sides 206 d and 207 d, so that themagnetic sensor chips 202 and 203 are respectively inclined atprescribed angles. Herein, the stages 206 and 207 are not necessarilyinclined by using the pins F and I. That is, it is required that thestages 206 and 207 be inclined after the magnetic sensor chips 202 and203 are bonded onto the surfaces 206 a and 207 a of the stages 206 and207 and before the molded resin casing 205 is formed so as toencapsulate the stages 206 and 207 therein.

The magnetic sensor chips 202 and 203 are not necessarily bonded ontothe surfaces 206 a and 207 a of the stages 206 and 207. That is, atlease one magnetic sensor chip can be bonded onto the backside of thestage (206 or 207).

4. Fourth Embodiment

Before specifically describing a fourth embodiment of the invention, thebasic configuration and concept therefor will be described withreference to FIGS. 75 and 76, wherein a magnetic sensor 351 comprises amagnetic sensor chip 352, a plurality of leads 353 for electricallyconnecting the magnetic sensor chip 352 with an external device (notshown), and a molded resin 354 for integrally fixing them at prescribedpositions therein.

The magnetic sensor chip 352 is arranged in an X-Y plane defined by anX-axis and a Y-axis on a stage 355, thus detecting components of anexternal magnetic field in both the X-axis and Y-axis directions.

Bases 353 a of the leads 353 are electrically connected with themagnetic sensor chip 352 via metal wires 356, and tip ends 353 b of theleads 353 are projected outside of the surface of the molded resin 354.

The aforementioned magnetic sensor 351 can be used in various fields,examples of which will be described below.

For example, the magnetic sensor 351 can be adapted to medicalinstruments such as tip ends of catheters, fiberscopes, or cameras,whereby it detects a direction of the tip end of a catheter or an imagepickup direction of a camera. Therefore, it is possible to measure thedirection of the tip end of the catheter or bearings of the camera,which is inserted into a human body, in a three-dimensional manner.

In addition, it is possible to install the magnetic sensor 351 in aportable terminal device, whereby terrestrial magnetism is detected soas to measure bearings of the portable terminal device, so thatnavigation functions for displaying measured bearing on a display screencan be adapted to the portable terminal device. In order to accuratelydetermine bearings of magnetism, it is necessary to measure them in athree-dimensional manner.

However, the aforementioned magnetic sensor 351 cannot always secure theX-Y plane of the magnetic sensor chip 352 so as to be always directed inparallel with the direction of an external magnetic field whenperforming bearing measurement. For this reason, when the direction ofan external magnetic field crosses the X-Y plane, the magnetic sensorchip 352 detects components of magnetism in the X-axis and Y-axisdirections only, and it is difficult to detect components of magnetismin another direction crossing the X-Y plane. This indicates difficultiesin accurately measuring bearings of an external magnetic field in athree-dimensional manner.

In order to accurately measure the three-dimensional bearings of anexternal magnetic field, it is possible to provide the foregoingmagnetic sensor unit 64 shown in FIG. 83, details of which have beenalready described previously. In general, the magnetic sensor adapted toa medical instrument such as a catheter, a fiberscope, or a camera,which is inserted into a human body, should be reduced in size. However,the foregoing magnetic sensor unit 64 has difficulties in being adaptedto such a medical instrument, wherein it is constituted by arranging themagnetic sensor 61 so as to be perpendicular to the surface 63 a of theboard 63, such that the magnetic sensor unit 64 is increased in thethickness dimensions in the Z-axis direction thereof. In addition, themanufacturing cost of the magnetic sensor unit 64 increases because ofthe requirement of two magnetic sensors 51 and 61 therefor. In short, itis strongly desired to reduce the overall size of the magnetic sensorthat can accurately measure three-dimensional bearings of magnetism.

A fourth embodiment of the invention will be described with reference toFIGS. 63 and 64, wherein a magnetic sensor 301 comprises two magneticsensor chips 302 and 303, a plurality of leads 304 for electricallyconnecting the magnetic sensor chips 302 and 303 with an external device(not shown), and a molded resin casing 305 (e.g., a package) forintegrally fixing the magnetic sensor chips 302 and 303 and the leads304 at prescribed positions therein.

Each of the magnetic sensor chips 302 and 303 is formed in a rectangularplate-like shape in plan view, and they are mounted on stages 306 and307 respectively. In addition, the magnetic sensor chips 302 and 303 areboth encapsulated in the molded resin casing 305, and they are arrangedabove bases 304 a of the leads 304 and in proximity to an upper surface305 c of the molded resin casing 305. Furthermore, the magnetic sensorchips 302 and 303 are respectively inclined at prescribed angles againsta lower surface (or a bottom) 305 a of the molded resin casing 305, andends 302 b and 303 b thereof are directed towards the upper surface 305c of the molded resin casing 305, so that surfaces 302 a and 303 athereof are mutually inclined to each other with an acute angle θtherebetween. Herein, the acute angle θ is formed between a surface 306a of the stage 306 and a backside 307 b of the stage 307.

In the above, the magnetic sensor chip 302 is sensitive to components ofan external magnetic field in two directions (i.e., directions A and B),which cross each other with a right angle therebetween along the surface302 a thereof. The magnetic sensor chip 303 is sensitive to componentsof an external magnetic field in a single direction (i.e., a directionC), which is laid along a surface 303 a thereof and which crosses at anacute angle to the A-B plane defined by the directions A and B.

Each of the leads 304 is made of a prescribed metal material such ascopper, and each comprises a base 304 a, a tip end 304 b, and aninterconnecting portion 304 c for interconnecting the base 304 a and tipend 304 b together, each of them having a crank-like sectional shape.

The bases 304 a of the leads 304 are partially embedded inside of themolded resin casing 305, and the leads 304 are electrically connectedwith the magnetic sensor chips 302 and 303 via metal wires 308. Both thetip ends 304 b and interconnecting portions 304 c of the leads 304 arearranged outside of side surfaces 305 b of the molded resin casing 305,and the tip ends 304 b are arranged below the lower surface 305 a of themolded resin casing 305.

Next, a description will be given with respect to a manufacturing methodof the aforementioned magnetic sensor 301.

A thin metal plate is subjected to either press working or etching, orit is subjected to both press working and etching, thus producing a leadframe in which the leads 304 are integrally connected with the stages306 and 307. The magnetic sensor chips 302 and 303 are respectivelybonded onto the surfaces 306 a and 307 a of the stages 306 and 307;then, they are electrically connected with the leads 304 via the metalwires 308.

The lead frame is subjected to plastic and/or elastic deformation sothat the stages 306 and 307 are inclined at prescribed anglesrespectively; thereafter, the molded resin casing 305 is formed so as tofix the magnetic sensor chips 302 and 303 at prescribed positionstherein. Lastly, cutting is performed so as to separate the leads 304from the stages 306 and 307, thus completing the manufacture of themagnetic sensor 301.

In the above, it is possible to mount the magnetic sensor chips 302 and303 on the stages 306 and 307 and to arrange the metal wires 308 afterthe lead frame is subjected to plastic deformation and/or elasticdeformation.

The aforementioned magnetic sensor 301 is mounted on a board (or asubstrate) installed in a portable terminal device (not shown), whereinan LSI circuit (i.e., a Large Scale Integrated circuit) encapsulated ina molded resin is independently arranged on the board in order toprocess output signals of the magnetic sensor chip 301. Thus, theportable terminal device can display bearings of terrestrial magnetismmeasured by the magnetic sensor 301 on a display screen.

Similar to the foregoing first embodiment (see FIG. 9), the magneticsensor chips 302 and 303 measure components of magnetism in thedirections A, B, and C, thus producing values Sa, Sb, and Sc inproportion to measured components of magnetism.

In the magnetic sensor 301, the magnetic sensor chip 302 detectscomponents of magnetism within the A-B plane, and the magnetic sensorchip 303 detects other components of magnetism in the direction C.Therefore, it is possible to determine the bearings of magnetism as avector in a three-dimensional space; thus, it is possible to accuratelymeasure the three-dimensional bearings of magnetism.

In the above, the magnetic sensor chips 302 and 303 are mutuallyinclined to each other with an acute angle therebetween, so thatcompared with the conventional magnetic sensor in which magnetic sensorchips are arranged so as to cross at a right angle therebetween, it ispossible to reduce the thickness dimensions of the magnetic sensor 301,which are measured between the lower surface 305 a and the upper surface305 c of the molded resin casing 305; that is, it is possible to reducethe overall size of the magnetic sensor 301.

In addition, both magnetic sensor chips 302 and 303 are completelyencapsulated in the molded resin casing 305, whereby it is possible toreliably maintain the magnetic sensor chips 302 and 303 in inclinedstates. The magnetic sensor 301 can be easily installed in the portableterminal device because it is only necessary to match the lower surface305 a of the molded resin casing 305 with the surface of the board.

In the fourth embodiment, the magnetic sensor chips 302 and 303 areinclined to each other such that ends 302 b and 303 b thereof aredirected towards the upper surface 305 c of the molded resin casing 305,but this is not restrictive. That is, it is required that the magneticsensor chips 302 and 303 be respectively inclined against the lowersurface 305 a of the molded resin casing 305.

For example, as shown in FIG. 65, the magnetic sensor chips 302 and 303can be inclined inversely so that ends 302 b and 303 b thereof aredirected towards the lower surface 305 a of the molded resin casing 305.Alternatively, as shown in FIGS. 66 and 67, they can be inclined to eachother so that opposite ends 302 d and 303 d thereof are directed towardsthe upper surface 305 c of the molded resin casing 305. In this case,the magnetic sensor chip 303 is arranged so that the sensing directionthereof crosses the A-B plane, specifically, the sensing directionthereof matches a direction D perpendicular to the direction C along thesurface 303 a thereof.

In the fourth embodiment, the magnetic sensor chips 302 and 303 areinclined to each other so that the surfaces 302 a and 303 a thereof areinclined against the lower surface 305 a of the molded resin casing 305,but this is not restrictive. That is, it is required that the magneticsensor chips 302 and 303 be mutually inclined. For example, it ispossible to arrange the magnetic sensor chip 302 so that the surface 302a is laid in parallel with the bottom 305 a as shown in FIG. 68.

In addition, both magnetic sensor chips 302 and 303 are arranged abovethe bases 304 a of the leads 304, but this is not restrictive. Forexample, as shown in FIG. 69, they can be arranged substantially belowthe bases 304 a of the leads 304.

The magnetic sensor chips 302 and 303 are not necessarily bonded ontothe surfaces 306 a and 307 a of the stages 306 and 307; therefore, theycan be bonded onto backsides 306 b and 307 b of the stages 306 and 307.For example, as shown in FIG. 70, only the magnetic sensor chip 303 maybe bonded onto the backside 307b of the stage 307.

The magnetic sensor chips 302 and 303 are not necessarily fixed insideof the molded resin casing 305. For example, a prescribed area of themagnetic sensor 301 is filled with ceramic paste, which is subjected tosintering so as to produce a ceramic package, by which the magneticsensor chips 302 and 303 can be fixed in position.

The sensing direction of the magnetic sensor chip 303 is not necessarilylimited to the direction C or D, wherein it is required that the sensingdirection of the magnetic sensor chip 303 certainly crosses the A-Bplane. Of course, the magnetic sensor chip 303 does not necessarily havea single sensing direction; therefore, as shown in FIGS. 71 and 72, themagnetic sensor chip 303 provides two sensing directions (namely,directions C and E) that cross each other along the surface 303 athereof.

In a magnetic sensor 320 shown in FIGS. 71 and 72, the plane includingsensing directions of the magnetic sensor chip 302 crosses the planeincluding sensing directions of the magnetic sensor chip 303, whereby itis possible to simultaneously detect components of magnetism in fourdirections within a three-dimensional space. Therefore, it is possibleto determine bearings of magnetism as a vector in a three-dimensionalspace; thus, it is possible to accurately measure bearings of magnetism.

In the above, the sensing directions of the magnetic sensor chips 302and 303 can cross each other with acute angles therebetween, wherebycompared to the foregoing magnetic sensor in which sensing directionsmerely cross each other with a right angle therebetween, it is possibleto further reduce the thickness dimensions of the magnetic sensor 320,which can be thus reduced in size.

Since each of the magnetic sensor chips 302 and 303 has two sensingdirections, it is possible to use magnetic sensor chips of the same typefor the magnetic sensor 320, which can thus reduce the manufacturingcost.

The magnetic sensor does not necessarily incorporate two magnetic sensorchips (302 and 303); that is, it is possible to arrange an arbitrarynumber of magnetic sensor chips in the magnetic sensor. For example, asshown in FIGS. 73 and 74, it is possible to use three magnetic sensorchips 302, 303, and 309 for a magnetic sensor 330, and each magneticsensor chip is sensitive to components of magnetism in a singledirection. Herein, the magnetic sensor chips 302 and 303 have sensingdirections F and G, which cross with a right angle therebetween, whereasthe magnetic sensor chip 309 has a sensing direction H that crosses at aright angle to an F-G plane defined by the sensing directions F and G.

The aforementioned magnetic sensor 330 can detect components ofmagnetism in all directions on the F-G plane defined by the sensingdirections F and G of the magnetic sensor chips 302 and 303. Inaddition, the magnetic sensor chip 309 can detect components ofmagnetism in the direction H crossing the F-G plane. Therefore, it ispossible to reliably detect components of magnetism in three directionswithin a three-dimensional space by use of the three magnetic sensorchips 302, 303, and 309. That is, it is possible to reduce the overallsize of the magnetic sensor 330 that can measure bearings of magnetismas a vector in a three-dimensional space.

In the above, it is possible to set the sensing direction H of themagnetic sensor chip 309 so as to cross at an acute angle to the F-Gplane, whereby compared with the magnetic sensor in which the sensingdirection H merely crosses at a right angle to the F-G plane, it ispossible to reduce the thickness dimensions of the magnetic sensor 330,which can be thus reduced in size. Since the magnetic sensor 330 can beconstituted using three magnetic sensor chips of the same type eachhaving a single sensing direction, it is possible to reduce themanufacturing cost therefor.

When the aforementioned magnetic sensors 320 and 330 are not necessarilydesigned in consideration of reducing size, it is possible to simplyarrange the magnetic sensor chips (302 and 302; or 302, 303, and 309) soas to mutually cross at a right angle therebetween. Alternatively, it ispossible to arrange the magnetic sensor chips in a slanted manner inplan view. In this case, it is possible to improve the flow of a resinin the formation of the molded resin casing and the like.

In the fourth embodiment, both the magnetic sensor 301 and the LSIcircuit encapsulated in a molded resin are independently arranged on theboard of the portable terminal device. Alternatively, it is possible tointegrally encapsulate both the magnetic sensor 301 and the LSI circuitin the same molded resin, thus producing a single package incorporatingthem. In this case, the magnetic sensor 301 and the LSI circuit can bearranged vertically with respect to each other, or they can be arrangedhorizontally adjacent to each other.

In addition, both the magnetic sensor chips and the LSI circuit arebonded onto the same lead frame, which is then encapsulated in a moldedresin so as to integrally fix them at prescribed positions. Of course,the magnetic sensor chips and the LSI circuit are not necessarilyintegrally incorporated in the same molded resin. That is, it ispossible to encapsulate the magnetic sensor chips and the LSI circuitindependently of each other in respective molded resins; then, they arefixed onto the stages made of metal materials.

In the fourth embodiment, each of the leads 304 has a crank-likesectional shape, wherein the tip ends 304 b are arranged below the lowersurface 305 a of the molded resin casing 305, but this is notrestrictive. That is, it is required that prescribed parts of the leads304 be exposed below the lower surface 305 a of the molded resin casing305.

In addition, this invention is not necessarily limited to the fourthembodiment in the number and positions of the leads 304 and wires 308.That is, it is possible to arbitrarily change the number and bondingpositions of the wires 308 being connected with the magnetic sensorchips; and it is possible to arbitrarily change the number and positionsof the leads 304.

Furthermore, the magnetic sensor 301 is not necessarily installed in theportable terminal device; that is, it can be installed in a medicalinstrument such as a catheter, a fiberscope, or a camera, which isinserted into a human body. For example, in order to measure bearings ofa camera inserted into a human body, the magnetic sensor 301 isactivated so as to measure bearings of a magnetic field under which thehuman body is placed. Therefore, it is possible to measure a relativeangle of the magnetic sensor 301 in the magnetic field in athree-dimensional manner; thus, it is possible to accurately detectbearings of the camera with reference to the direction of the magneticfield.

As described heretofore, the fourth embodiment has a variety oftechnical features in comparison with the foregoing embodiments, whichwill be described below.

(1) A magnetic sensor can be constituted using three magnetic sensorchips each having a sensing direction, and the third magnetic sensorchip has a sensing direction that crosses at an acute angle to a planedefined by sensing the directions of the other two magnetic sensorchips. Herein, it is possible to reduce the thickness dimensions of themagnetic sensor, which can be thus reduced in size. Since the magneticsensor can be constituted by using plural magnetic sensor chips of thesame type each having a single sensing direction, it is possible toreduce the manufacturing cost therefor.

(2) When a magnetic sensor is constituted using two magnetic sensorchips each having two sensing directions, it is possible to measurecomponents of magnetism in a total of four directions within athree-dimensional space. Herein, bearings of magnetism can be determinedas a vector in a three-dimensional space; thus, it is possible toaccurately measure bearings of magnetism.

(3) When the sensing directions of two magnetic sensor chips cross eachother at acute angles therebetween, it is possible to reduce thethickness dimensions of the magnetic sensor, which can be thus reducedin size. Herein, the magnetic sensor is constituted using two magneticsensor chips of the same type, and it is possible to reduce themanufacturing cost therefor.

(4) It is possible to reliably maintain plural magnetic sensor chips ininclined states fixed in a package, wherein the magnetic sensor can beeasily installed on a board by merely matching the bottom of the packagewith the surface of the board.

5. Fifth Embodiment

A description will be given with respect to a magnetic sensor that ismanufactured in a manufacturing method according to a fifth embodimentof the invention with reference to FIGS. 77 and 78. That is, a magneticsensor 401, which is designed to measure the direction and magnitude ofan external magnetic field, comprises two magnetic sensor chips 402 and403, a plurality of leads 404 for electrically connecting the magneticsensor chips 402 and 403 with an external device (not shown), and amolded resin casing 405 for integrally encapsulating the magnetic sensorchips 402 and 403 as well as the leads 404 therein.

Each of the magnetic sensor chips 402 and 403 is formed in a rectangularplate-like shape in plan view, and are mounted on stages 406 and 407respectively. Both magnetic sensor chips 403 and 404 are completelyencapsulated in the molded resin casing 405, and are arranged belowbases 404 a of the leads 404 and close to an upper surface 405 c of themolded resin casing 405. In addition, the magnetic sensor chips 402 and403 are inclined against a lower surface 405 a of the molded resincasing 405, ends 402 b and 403 b thereof are directed towards the uppersurface 405 c of the molded resin casing 405, and surfaces 402 a and 403a thereof are mutually inclined to each other with an acute angle θtherebetween. The acute angle θ is formed between a surface 406 a of thestage 406 and a backside 407 b of the stage 407.

The magnetic sensor chip 402 is sensitive to components of magnetism ofan external magnetic field in two directions (i.e., directions A and B),which cross at a right angle along the surface 402 a thereof. Themagnetic sensor chip 403 is sensitive to components of magnetism of anexternal magnetic field in a single direction (i.e., a direction C),which crosses with an acute angle to the A-B plane defined by thedirections A and B along the surface 403 a thereof.

Each of the leads 404 is made of a prescribed metal material such ascopper, and they are constituted by bases 404 a, tip ends 404 b, andinterconnecting portions 404 c for interconnecting between the bases 404a and tip ends 404 b. Therefore, each of them has a crank-like sectionalshape.

The bases 404 a of the leads 404 are partially embedded in the moldedresin casing 405, and the leads 404 are electrically connected with themagnetic sensor chips 402 and 403 via metal wires 408. The tip ends 404b and interconnecting portions 404 c of the leads 404 are arrangedoutside of side surfaces 405 b of the molded resin casing 405, and thetip ends 404 b are arranged below the lower surface 405 a of the moldedresin casing 405.

Next, a description will be given with respect to a manufacturing methodof the aforementioned magnetic sensor 401.

A thin metal plate is subjected to either press working or etching, orit is subjected to both press working and etching, thus producing a leadframe 410 including stages 406 and 407 supported by a frame 409 as shownin FIGS. 79 and 80. The frame 409 has a rectangular frame portion 411for encompassing the stages 406 and 407, and a plurality of leads 404and 412 that are projected inwardly from the rectangular frame portion411.

The leads 412 are hanging leads for fixing the stages 406 and 407 atprescribed positions to the rectangular frame portion 411, and ends 412a of the leads 412, which are arranged in proximity to the stages 406and 407 respectively, constitute distorted portions that can be easilydistorted upon plastic deformation (and/or elastic deformation) when thestages 406 and 407 are inclined. Cutouts are formed on both sides ofends 412 a of the leads 412, which are thus reduced in width comparedwith other portions of the leads 412.

Ends 412 a are formed at prescribed positions of the leads 412 inparallel with both side ends of the stages 406 and 407, and they arearranged linearly symmetrical with respect to a center axial line Lpassing through the centers of the stages 406 and 407.

After preparation of the lead frame 410, the magnetic sensor chips 402and 403 are bonded onto the surfaces 406 a and 407 a of the stages 406and 407 respectively; then, they are electrically connected with theleads 404 via the metal wires 408.

In the above, when the stages 406 and 407 are inclined, bonding portionsbetween the wires 408 and the magnetic sensor chips 402 and 403 must beseparated from bonding portions between the wires 408 and the leads 404;therefore, the wires 408 are arranged so as to have sufficient room inlength or height thereof.

Then, as shown in FIG. 81, the frame 409 of the lead frame 410 is heldin a metal mold consisting of an upper mold Dm and a lower mold Em,except for prescribed parts of the leads 404 and 412, and the magneticsensor chips 402 and 403 are embedded in a resin. Two holes E2 areformed at prescribed positions on an interior wall E1 of the lower moldEm, and pins F are arranged so as to freely move up and down in theholes E2.

As shown in FIG. 81, the pins F are moved upwards to press up thebacksides 406 b and 407 b of the stages 406 and 407 relative to terminalends 406 c and 407 c, so that the stages 406 and 407 are inclined atprescribed angles together with the magnetic sensor chips 402 and 403.

In the above, the stages 406 and 407 are respectively rotated aboutaxial lines that connect together ends 412 a of the leads 412 arrangedin proximity to both side ends thereof, so that ends 412 a of the leads412 are distorted and deformed. Thus, it is possible to incline themagnetic sensor chips 402 and 403 against the interior wall E1 of thelower mold Em as well as other portions of the leads 412.

Under the aforementioned condition where the backsides 406 b and 407 bof the stages 406 and 407 relative to the terminal ends 406 c and 407 care pressed upwards by the pins F, a melted resin is injected into thecavity of the metal mold consisting of the upper mold Dm and lower moldEm, and a molded resin is formed so as to encapsulate both magneticsensor chips 402 and 403 therein. After completion of hardening of theresin, the pins F are moved downwards. Thus, it is possible to reliablyfix the magnetic sensor chips 402 and 403 mutually inclined to eachother in the molded resin.

Lastly, the rectangular frame portion 411 and unwanted portions of theleads 412, which are projected outside of the molded resin, are cut,thus completing the manufacture of the magnetic sensor 401 shown in FIG.77.

The aforementioned magnetic sensor 401 is mounted on a board (or asubstrate) installed in a portable terminal device (not shown), in whichbearings of magnetism measured by the magnetic sensor 401 are displayedon a display screen. That is, similar to the foregoing first embodiment(see FIG. 9), the magnetic sensor chips 402 and 403 detect components ofmagnetism in the directions A, B, and C, thus producing values Sa, Sb,and Sc in proportion to the detected components of magnetism.

In the manufacturing method of the magnetic sensor 401 according to thefifth embodiment, the magnetic sensor chips 402 and 403 are bonded ontothe stages 406 and 407 before inclination, so that they can beaccurately bonded onto the surfaces 406 a and 407 a of the stages 406and 407, both of which are arranged substantially in the same plane.Therefore, it is possible to simultaneously bond the magnetic sensorchips 402 and 403 onto the stages 406 and 407 of the lead frame 410 withease. In addition, it is possible to perform the step for inclining thestages 406 and 407, and the step for forming the molded resin casing 405by use of the same metal mold. Thus, it is possible to reduce the numberof steps in the manufacture of the magnetic sensor 401, which thusreduces the manufacturing cost.

Noticeably, one ends 412 a of the leads 412 constitute distortedportions, which are distorted and deformed when the pins F are insertedinto the metal mold to press up the backsides 406 b and 407 b of thestages 406 and 407 relative to the terminal ends 406 c and 407 crespectively. Thus, it is possible to incline the stages 406 and 407against the frame 409 with ease.

In addition, the molded resin casing 405 is formed in the metal mold inwhich the stages 406 and 407 are inclined under pressure applied theretoby the pins F. Therefore, it is possible to accurately set a prescribedangle formed between the surfaces 402 a and 403 a of the magnetic sensorchips 402 and 403 with ease.

As described above, it is possible to accurately cross the sensingdirection of the magnetic sensor chip 403 with the A-B plane. Therefore,it is possible to determine bearings of magnetism in three sensingdirections as a vector within a three-dimensional space, and it ispossible to accurately measure three-dimensional bearings of magnetism.

In the fifth embodiment, the pins F are moved downwards after the resinis completely hardened, but this is not restrictive. That is, it ispossible to move the pins F downwards when the resin is hardened to someextent such that the stages 406 and 407 can be maintained in inclinedstates thereof. In this case, a melted resin may flow into areas inwhich the pins F are temporarily projected above the interior wall E1and are then retracted inside of the hole E2 of the lower mold Em, sothat the stages 406 and 407 can be completely embedded in the resin.

In the above, the pins F can be moved downwards at any timing if thestages 406 and 407 are securely maintained in inclined states inaccordance with plastic deformation and/or elastic deformation on theleads 412. When the leads 412 are distorted upon plastic deformation, itis possible to move down the pins F before injection of a resin into themold. When the leads 412 are distorted upon both of the plasticdeformation and elastic deformation, it is possible to move down thepins F when the resin is sufficiently hardened to securely maintain thestages 406 and 407 in inclined states.

The pins F are not necessarily moved up and down in the holes E2 withrespect to the interior wall E1 of the lower mold Em. That is, they cannormally be projected above the interior wall E1 of the lower mold Em.In this case, when the frame 409 is placed in the metal mold, the stages406 and 407 are automatically inclined at prescribed angles.

In addition, the aforementioned pins F are not necessarily arranged inthe lower mold Em, in other words, they can be arranged in the uppermold Dm. In this case, it is required that the surfaces 406 a and 407 aof the stages 406 and 407 be pressed downwards so as not to bring thestages 406 and 407 in contact with the wires 408 and the magnetic sensorchips 402 and 403.

Each of the stages 402 and 403 is not necessarily pressed by a singlepin F; that is, it can be pressed by two pins. For example, a pair ofpins projected upwards from the lower mold Em are used to press up thebacksides 406 b and 407 b of the stages 406 and 407 relative to theterminal ends 406 c and 407 c respectively, while a pair of pinsprojected downwards from the upper mold Dm are used to press thesurfaces 406 a and 407 a of the stages 406 and 407 relative to othersides or other portions.

The aforementioned cutouts are not necessarily formed in ends 412 a ofthe leads 412. That is, the leads 412 are formed so as to be easilydistorted when the stages 406 and 407 are inclined. In addition, thedistorted portions are not necessarily formed in ends 412 a of the leads412. That is, they can be formed at arbitrary positions of the leads 412separated from ends 412 a towards the rectangular frame portion 411.

The stages 406 and 407 are not necessarily inclined by distortingprescribed parts of the leads 412. That is, it is required that theleads 412 are formed so as to support the stages 406 and 407 and toeasily incline them. For example, as shown in FIGS. 82A and 82B, theleads 412 are formed such that ends 412 a thereof for supporting thestages 406 and 407 can be easily bent and subjected to plasticdeformation and/or elastic deformation.

In the fifth embodiment, the magnetic sensor chips 402 and 403 areinclined such that ends 402 b and 403 b thereof are directed towards theupper surface 405 c of the molded resin casing 405, but this is notrestrictive. That is, the magnetic sensor chips 402 and 403 should bemutually inclined to each other against the frame 409 such that thesensing direction of the magnetic sensor chip 403 crosses the A-B plane.

Furthermore, the magnetic sensor chips 402 and 403 are not necessarilybonded onto the surfaces 406 a and 407 a of the stages 406 and 407. Thatis, at least one magnetic sensor chip can be bonded onto the backside ofthe stage.

As described above, the fifth embodiment has a variety of technicalfeatures compared with other embodiments, which will be described below.

(1) Interconnecting members are arranged on both side ends of stages ofa lead frame and are arranged linearly symmetrical to a center axialline passing through the centers of the stages, and they have distortedportions that can be distorted upon plastic deformation (and/or elasticdeformation). Herein, the interconnecting members are distorted at thedistorted portions thereof under pressure applied to the stages, whichare thus inclined against a frame with ease.

(2) The same metal mold can be used for all of the steps forsimultaneously bonding magnetic sensor chips onto the stages, forinclining the stages, and for forming a molded resin encapsulating themagnetic sensor chips and the stages therein. Therefore, it is possibleto reduce the number of steps in the manufacture of a magnetic sensor,which can thus reduce the manufacturing cost.

(3) Pins are used to press the stages to be inclined in a metal mold,into which a melted resin is injected to form a molded resinencapsulating the magnetic sensor chips and the stages, which aremutually inclined with a prescribed angle therebetween. Herein, it ispossible to accurately set the prescribed angle formed between thesurfaces of the magnetic sensor chips. When one magnetic sensor chip hastwo sensing directions and another magnetic sensor chip has a singlesensing direction, it is possible to determine bearings of magnetism asa vector in a three dimensional manner; hence, it is possible toaccurately measure three-dimensional bearings of magnetism.

6. Package and Lead Frame

The aforementioned embodiments (e.g., fourth embodiment) are basicallyconcerned with a single package of a magnetic sensor including pluralmagnetic sensor chips that are inclined at prescribed anglesrespectively. Herein, it is possible to arrange a plurality of packageseach including at least one magnetic sensor chip. For example, as shownin FIG. 85A, a plurality of packages, i.e., magnetic sensor chips S1 andS2, which are respectively inclined at prescribed angles and which arehorizontally arranged on the same substrate so that the sensingdirections of the magnetic sensor chips cross at an acute angletherebetween, wherein they are covered with a resin cover cap or a metalcover cap made of a non-magnetic metal material such as aluminum. Ofcourse, they can be vertically arranged as shown in FIG. 85B, whereinthe overall chip-installed area of a (printed-circuit) board can bereduced compared with the horizontal arrangement shown in FIG. 85A.

In FIG. 85A, the cover cap (simply referred to as a cover) is notnecessarily arranged on the board to encapsulate the magnetic sensorchips S1 and S2 therein. When the cover is arranged on the substrate,the inside space of the cover is hollow and is filled with a prescribedgas, wherein each of the magnetic sensor chips S1 and S2 is notnecessarily sealed in a resin but can be formed in a hollow manner. Thecover is bonded onto the substrate by solder. Multilayer wiring made ofCu or Al is arranged on the substrate made of a resin material such aspoly-imide or epoxy resin, wherein grid pins or balls are formed on thebackside of the substrate, which is connected with the board.

The vertical arrangement shown in FIG. 85B is increased in heightcompared with the horizontal arrangement shown in FIG. 85A, wherein theoverall thickness can be reduced compared with the conventional art inwhich magnetic sensors are physically arranged in a three-dimensionalmanner. Thus, it is possible to reduce the overall chip-installed areaof the board.

When two sets of magnetic sensor chips (horizontally or verticallyarranged on substrates) are arranged on the same board, it is possibleto use the same type(s) of chips, which is convenient in design and inmanufacture. Herein, two sensing directions can be respectively set tothe magnetic sensor chips in parallel with their arrangement, or sensingdirections can be set to the magnetic sensor chips perpendicularly totheir arrangement.

Details of the horizontal arrangement of the magnetic sensor chips S1and S2 are shown in FIG. 86. The aforementioned magnetic sensor chips S1and S2 can be arranged on a prescribed board for use in a portabletelephone (or a cell phone) as shown in FIG. 87A, wherein they arearranged on both sides of a CPU. In FIG. 87A, reference symbols M1 to M6designate memories, M7 designates a program storage chip, C1 and C2designate communication chips (which may incorporate GPS (globalpositioning system) functions, for example), and C3 designates otherchips having prescribed functions such as a temperature sensor chip, aninclination sensor chip, a GPS function chip, and graphics controllerchip, for example. FIG. 87B is a longitudinal sectional view taken alongline A-a′ in FIG. 87A.

It is possible to arrange four magnetic sensor chips S1 to S4 toencompass a CPU on a board as shown in FIG. 88, wherein reference symbolA1 designates an area for arranging a memory chip (or memory chips), A2designates an area for arranging a program storage chip, A3 designatesan area for arranging a communication chip, and A4 designates an areafor arranging other chips having prescribed functions. Alternatively, itis possible to design a multi-chip package as show in FIG. 89 in whichmagnetic sensor chips S1 and S2 vertically coupled together are arrangedadjacent to a CPU accompanied with a plurality of memory chips on aboard having a cover. The multi-chip package can be designed as shown inFIG. 90 in which magnetic sensor chips S1 and S2 are arranged verticallyvia a board on which a CPU and memory chips are arranged. As terminalsarranged on the backside of the board, it is possible to use BGA (BallGrid Array) and PGA (Pin Grid Array), for example.

Next, various examples of the lead frame applicable to theaforementioned magnetic sensor chip will be described. FIG. 91A shows afirst example of the lead frame including a single die stageinterconnected with support arms and bent portions, wherein the stage ispositioned approximately at the center of the lead frame and whereinwhen the stage is inclined, the support arms are not bent as shown inFIG. 91B.

FIG. 92A shows a second example of the lead frame including a singlestage interconnected with support arms and bent portions, wherein whenthe stages are inclined, the support arms are correspondingly bent toreduce the positional deviation of the stage during inclination as shownin FIG. 91B.

FIG. 93A shows a third example of the lead frame including a singlestage interconnected with support arms and bent portions, wherein thesupport arms are aligned along the center line of the stage, which isthus inclined about the center thereof as shown in FIG. 93B. Thus, it ispossible to reduce the positional deviation of the stage duringinclination.

FIG. 94A shows a fourth example of the lead frame including a singlestage whose four corners are interconnected with bent portions, wherebyit is possible to incline the stage in any direction within 360-degreerange as shown in FIG. 94B.

FIG. 95A shows a fifth example of the lead frame including a singlestage, which is inclined upon deformation of projections as shown inFIG. 95B.

FIG. 96A shows a sixth example of the lead frame including a singlestage, which is inclined by partially cut prescribed portions thereof asshown in FIG. 96B, wherein it is possible to stabilize the stage in aninclined state.

FIG. 97A shows a seventh example of the lead frame including a singlestage, wherein support arms are aligned along the center line of thestage, which is inclined by bent projections upwards and downwards asshown in FIG. 97B. Thus, it is possible to establish accuratepositioning with respect to the stage during inclination.

As this invention may be embodied in several forms without departingfrom the spirit or essential characteristics thereof, the presentembodiments are therefore illustrative and not restrictive, since thescope of the invention is defined by the appended claims rather than bythe description preceding them, and all changes that fall within metesand bounds of the claims, or equivalents of such metes and bounds aretherefore intended to be embraced by the claims.

1. A lead frame made of a thin metal plate, comprising: at least twostages; a frame having a plurality of leads, which is arranged so as toencompass the stages; and a plurality of interconnecting members havingelastically deforming abilities, which are integrally combined togetherwith the frame and are arranged to connect the stages and the framewherein the interconnecting members are adapted to connect the stagesand the frames such that the stages are inclined with respect to theframe and wherein the stages are inclined with respect to each other atan acute angle θ.
 2. A lead frame according to claim 1, wherein theinterconnecting members include easy-to-deform portions that can beelastically deformed when pressed, and bent portions that can be bent byplastic deformation.
 3. A lead frame made of a thin metal plate,comprising: at least two stages; a frame having a plurality of leadsarranged so as to encompass the stages; and a plurality ofinterconnecting members for interconnecting the stages and the frametogether, the stages being inclined with respect to the frame and thestages being inclined with respect to each other at an acute angle θ,wherein the interconnecting members are interconnected with both sideends of the stages and are arranged linearly symmetrical to a centeraxial line passing through centers of the stages, and wherein theinterconnecting members have distorted portions that can be distortedupon plastic deformation and/or elastic deformation.